Inventor · disambiguated record
Paul Mccann
Also filed as: MCCANN PAUL D · MCCANN PAUL DAMIEN
2 granted patents·4 pending applications·30 citations·filing 2002–2007
61Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0171US6955988B2Method of forming a cavity and SOI in a semiconductor substrateANALOG DEVICES INC·Filed 2003·Granted Oct 18, 2005·19 cites·47 claims
- 0263US7153757B2Method for direct bonding two silicon wafers for minimising interfacial oxide and stresses at the bond interface, and an SOI structureANALOG DEVICES INC·Filed 2003·Granted Dec 26, 2006·11 cites·12 claims
- 0349US2008026230A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2007·Application pending·0 cites
- 0445US2006030123A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2005·Application pending·0 cites
- 0538US2005048737A1Method for bonding a pair of silicon wafers together, and a semiconductor waferFiled 2004·Application pending·0 cites
- 0636US2003148592A1Method for bonding a pair of silicon wafers together, and a semiconductor waferFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →