Inventor · disambiguated record
Bharatjeet Singh Gill
Also filed as: GILL BHARATJEET SINGH
12 granted patents·1 pending application·54 citations·filing 2014–2022
90Inventor score
Files withSKYWORKS SOLUTIONS INC13
Top patents by PatentIndex Score
13 records- 0194US10069466B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Sep 4, 2018·7 cites·20 claims
- 0293US9407215B2Circuits and methods related to low-noise amplifiers having improved linearitySKYWORKS SOLUTIONS INC·Filed 2014·Granted Aug 2, 2016·27 cites·20 claims
- 0391US10177716B2Solder bump placement for emitter-ballasting in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 8, 2019·5 cites·18 claims
- 0490US10193504B2Solder bump placement for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 29, 2019·4 cites·20 claims
- 0590US10181824B2Solder bump placement for grounding in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 15, 2019·4 cites·20 claims
- 0689US10447210B2Flip chip amplifier for wireless deviceSKYWORKS SOLUTIONS INC·Filed 2018·Granted Oct 15, 2019·3 cites·20 claims
- 0785US11515845B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 0885US10790788B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2018·Granted Sep 29, 2020·2 cites·19 claims
- 0982US12418265B2Direct substrate to solder bump connection for thermal management in flip chip amplifiersSKYWORKS SOLUTIONS INC·Filed 2022·Granted Sep 16, 2025·0 cites·22 claims
- 1080US11621676B2Auto-linearizing amplifierSKYWORKS SOLUTIONS INC·Filed 2020·Granted Apr 4, 2023·1 cites·20 claims
- 1168US11652079B2Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductancesSKYWORKS SOLUTIONS INC·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1262US2019199294A1Methods for thermal management in amplifiersSKYWORKS SOLUTIONS INC·Filed 2018·Application pending·0 cites
- 1355US11171110B2Backside metalization with through-wafer-via processing to allow use of high q bondwire inductancesSKYWORKS SOLUTIONS INC·Filed 2018·Granted Nov 9, 2021·0 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →