Inventor · disambiguated record
Ian Mccallum-Cook
Also filed as: MCCALLUM-COOK IAN · MCCALLUM-COOK IAN A
11 granted patents·2 pending applications·116 citations·filing 2014–2023
88Inventor score
Top patents by PatentIndex Score
13 records- 0198US10192779B1Bulk substrates with a self-aligned buried polycrystalline layerGLOBALFOUNDRIES INC·Filed 2018·Granted Jan 29, 2019·71 cites·12 claims
- 0296US10643927B1Ring isolated through-substrate vias for high resistivity substratesGLOBALFOUNDRIES INC·Filed 2018·Granted May 5, 2020·26 cites·19 claims
- 0393US10651281B1Substrates with self-aligned buried dielectric and polycrystalline layersGLOBALFOUNDRIES INC·Filed 2018·Granted May 12, 2020·4 cites·20 claims
- 0489US10832940B2Bulk substrates with a self-aligned buried polycrystalline layerGLOBALFOUNDRIES INC·Filed 2018·Granted Nov 10, 2020·3 cites·13 claims
- 0588US11158535B2Multi-depth regions of high resistivity in a semiconductor substrateGLOBALFOUNDRIES US INC·Filed 2019·Granted Oct 26, 2021·4 cites·20 claims
- 0683US9831194B1Edge compression layersGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 28, 2017·4 cites·20 claims
- 0782US11749559B2Bulk substrates with a self-aligned buried polycrystalline layerGLOBALFOUNDRIES US INC·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0873US11527432B2Bulk substrates with a self-aligned buried polycrystalline layerGLOBALFOUNDRIES INC·Filed 2020·Granted Dec 13, 2022·0 cites·19 claims
- 0973US9576899B2Electrical fuse with high off resistanceGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 21, 2017·2 cites·18 claims
- 1067US9383404B2High resistivity substrate final resistance test structureIBM·Filed 2014·Granted Jul 5, 2016·1 cites·20 claims
- 1166US10109599B2Integrated circuit structure with continuous metal crack stopGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 23, 2018·1 cites·20 claims
- 1258US2025079345A1Seal rings for a wide band-gap semiconductor layer stackGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1357US2025072024A1Transistor with thermal plugGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
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