Inventor · disambiguated record
Bum Woo Lee
Also filed as: LEE BUM-WOO
4 granted patents·2 pending applications·14 citations·filing 1998–2018
66Inventor score
Top patents by PatentIndex Score
6 records- 0169US8042593B2Semiconductor chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 25, 2011·9 cites·18 claims
- 0247US10665472B2System and method for removing foreign substances by using electric field adsorption methodLG CHEMICAL LTD·Filed 2017·Granted May 26, 2020·0 cites·18 claims
- 0341US11327211B2Asymmetric transmission filmLG CHEMICAL LTD·Filed 2018·Granted May 10, 2022·0 cites·20 claims
- 0437US2009035105A1Apparatus for separating chip, a method for fabricating the apparatus, and a method for separating a chipSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0529US2008000587A1Bonding apparatus of semiconductor packageHA YONG-DAE·Filed 2007·Application pending·0 cites
- 0624US6090220AMethod for transferring a wafer after removing a washing solutionSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 18, 2000·5 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →