Inventor · disambiguated record

Chee Hong Fang

Also filed as: FANG CHEE HONG

3 granted patents·12 citations·filing 2014–2017

57Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0186US9219025B1Molded flip-clip semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 22, 2015·12 cites·15 claims
0240US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
0327US10099411B2Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame stripsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 16, 2018·0 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →