Inventor · disambiguated record
Thiam B. Lim
Also filed as: LIM THIAM B · LIM THIAM BENG
19 granted patents·1 pending application·895 citations·filing 1987–2002
96Inventor score
Files withTEXAS INSTRUMENTS INC7INST OF MICROELECTRONICS6LIM THIAM B2INST OF MICROELECTRONICS NATIO1NAT RES DEV1
Top patents by PatentIndex Score
20 records- 0194US5925934ALow cost and highly reliable chip-sized packageINST OF MICROELECTRONICS·Filed 1996·Granted Jul 20, 1999·181 cites·10 claims
- 0289US6540866B1Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrateINST OF MICROELECTRONICS·Filed 2000·Granted Apr 1, 2003·49 cites·15 claims
- 0389US5773878AIC packaging lead frame for reducing chip stress and deformationINST OF MICROELECTRONICS NATIO·Filed 1996·Granted Jun 30, 1998·108 cites·14 claims
- 0485US6537411B1Method for low temperature lamination of metals to polyimidesUNIV SINGAPORE·Filed 2000·Granted Mar 25, 2003·37 cites·14 claims
- 0584US5227232AConductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distributionLIM THIAM B·Filed 1991·Granted Jul 13, 1993·80 cites·5 claims
- 0682US5893724AMethod for forming a highly reliable and planar ball grid array packageINST OF MICROELECTRONICS·Filed 1996·Granted Apr 13, 1999·57 cites·15 claims
- 0781US5319241ALead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distributionTEXAS INSTRUMENTS INC·Filed 1993·Granted Jun 7, 1994·60 cites·13 claims
- 0879US5892290AHighly reliable and planar ball grid array packageINST OF MICROELECTRONICS·Filed 1996·Granted Apr 6, 1999·55 cites·16 claims
- 0979US5434106AIntegrated circuit device and method to prevent cracking during surface mountTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 18, 1995·55 cites·6 claims
- 1078US5313102AIntegrated circuit device having a polyimide moisture barrier coatingTEXAS INSTRUMENTS INC·Filed 1989·Granted May 17, 1994·43 cites·21 claims
- 1168US5164815AIntegrated circuit device and method to prevent cracking during surface mountTEXAS INSTRUMENTS INC·Filed 1991·Granted Nov 17, 1992·38 cites·7 claims
- 1263US5155578ABond wire configuration and injection mold for minimum wire sweep in plastic IC packagesTEXAS INSTRUMENTS INC·Filed 1991·Granted Oct 13, 1992·36 cites·3 claims
- 1358US5229329AMethod of manufacturing insulated lead frame for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 20, 1993·30 cites·4 claims
- 1456US5206536AComb insert for semiconductor packaged devicesTEXAS INSTRUMENTS INC·Filed 1991·Granted Apr 27, 1993·24 cites·15 claims
- 1555US4745787APlug drawingNAT RES DEV·Filed 1987·Granted May 24, 1988·15 cites·12 claims
- 1645US6334926B1Method for low temperature lamination of metals to fluoropolymersNAT UNIVERSITY OF SINGAPORE AN·Filed 1999·Granted Jan 1, 2002·16 cites·16 claims
- 1741US6621151B1Lead frame for an integrated circuit chipINST OF MICROELECTRONICS·Filed 2000·Granted Sep 16, 2003·2 cites·15 claims
- 1836US5146312AInsulated lead frame for semiconductor packaged devicesLIM THIAM B·Filed 1991·Granted Sep 8, 1992·9 cites·4 claims
- 1934US2002175424A1Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the processFiled 2002·Application pending·0 cites
- 2028US6583501B2Lead frame for an integrated circuit chip (integrated circuit peripheral support)INST OF MICROELECTRONICS·Filed 2000·Granted Jun 24, 2003·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →