Inventor · disambiguated record
Jui-Chung Lee
Also filed as: LEE JUI-CHUNG
11 granted patents·6 pending applications·140 citations·filing 2001–2023
88Inventor score
Top patents by PatentIndex Score
17 records- 0191US11991853B2Cable clipQUANTA COMP INC·Filed 2022·Granted May 21, 2024·3 cites·16 claims
- 0288US6650008B2Stacked semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Nov 18, 2003·54 cites·25 claims
- 0387US6559526B2Multiple-step inner lead of leadframeMACRONIX INT CO LTD·Filed 2001·Granted May 6, 2003·52 cites·14 claims
- 0474US8133759B2LeadframeLEE JUI-CHUNG·Filed 2009·Granted Mar 13, 2012·7 cites·30 claims
- 0571US7122904B2Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2002·Granted Oct 17, 2006·16 cites·4 claims
- 0670US11678439B2Circuit boardMACRONIX INT CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·7 claims
- 0765US11304310B1Method of fabricating circuit boardMACRONIX INT CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·13 claims
- 0865US8240549B2IC package tray embedded RFIDLEE JUI-CHUNG·Filed 2009·Granted Aug 14, 2012·4 cites·15 claims
- 0957US2025054909A1Semiconductor deviceMACRONIX INT CO LTD·Filed 2023·Application pending·0 cites
- 1050US6977436B2Semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Dec 20, 2005·4 cites·23 claims
- 1147US2007018333A1Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2006·Application pending·0 cites
- 1238US2002180021A1Three-dimension multi-chip stack package technologyMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 1337US2002180020A1Three-dimension multi-chip stack package technologyFiled 2001·Application pending·0 cites
- 1436US2004021230A1Ultra thin stacking packaging deviceMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 1536US2004000703A1Semiconductor package body having a lead frame with enhanced heat dissipationFiled 2002·Application pending·0 cites
- 1635US8547233B2Integrated circuit and method of operating the sameLEE JUI-CHUNG·Filed 2010·Granted Oct 1, 2013·0 cites·20 claims
- 1734US7105869B2Multi-chip packageMACRONIX INT CO LTD·Filed 2004·Granted Sep 12, 2006·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →