Inventor · disambiguated record
Sungjun Im
Also filed as: IM SUNGJUN
4 granted patents·4 pending applications·70 citations·filing 2009–2024
69Inventor score
Top patents by PatentIndex Score
8 records- 0188US8115291B2Semiconductor packageBAEK JOONGHYUN·Filed 2009·Granted Feb 14, 2012·70 cites·13 claims
- 0261US11264301B2System and method to enhance reliability in connection with arrangements including circuitsWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 1, 2022·0 cites·17 claims
- 0359US2025357365A1Chip package assembly with surface mounted component protectionADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0458US11094604B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 0557US2025157864A1Integrated circuit device with raised lid attach areaADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0656US2025144971A1Apparatus and method for examining an air conditioner for a vehicleHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0755US2025006496A1Removing conductive material from a pedestal of a semiconductor lid outside of an area contacting a dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0851US10636722B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →