Inventor · disambiguated record
Cho-Hsin Chang
Also filed as: CHANG CHO-HSIN
7 granted patents·1 pending application·10 citations·filing 2008–2020
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0179US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
- 0279US9508656B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·8 claims
- 0366US9899335B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·1 cites·7 claims
- 0458US7655540B2Method and jig structure for positioning bare diceUNIVERSAL SCIENT IND CO LTD·Filed 2008·Granted Feb 2, 2010·2 cites·7 claims
- 0549US11527472B2Electronic package, supporting structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·14 claims
- 0649US10074613B2Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims
- 0747US9490219B2Semiconductor package with shielding member and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·0 cites·16 claims
- 0837US2012235259A1Semiconductor package and method of fabricating the sameFANG HAO-JU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →