Inventor · disambiguated record
Yasuhisa Nishi
Also filed as: NISHI YASUHISA
10 granted patents·3 pending applications·43 citations·filing 1994–2021
84Inventor score
Top patents by PatentIndex Score
13 records- 0186US7538645B2Electromagnetic relayNEC TOKIN CORP·Filed 2007·Granted May 26, 2009·16 cites·8 claims
- 0268US8063120B2Ceramic powder and use thereofNISHI YASUHISA·Filed 2007·Granted Nov 22, 2011·4 cites·20 claims
- 0367US8053495B2Ceramic powder and applications thereofDENKI KAGAKU KOGYO KK·Filed 2007·Granted Nov 8, 2011·4 cites·20 claims
- 0465US5548259AElectromagnetic relay having an improved resistivity to surgeNEC CORP·Filed 1994·Granted Aug 20, 1996·19 cites·19 claims
- 0551US7816428B2Inorganic hollow particle, process for producing the same, and composition containing the sameDENKI KAGAKU KOGYO KK·Filed 2007·Granted Oct 19, 2010·0 cites·14 claims
- 0645US8273807B2Ceramic powder and use thereofNISHI YASUHISA·Filed 2011·Granted Sep 25, 2012·0 cites·12 claims
- 0745US2011300384A1Powder, method for producing same, and resin composition containing sameNISHI YASUHISA·Filed 2009·Application pending·0 cites
- 0844US8592504B2Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation materialNISHI YASUHISA·Filed 2009·Granted Nov 26, 2013·0 cites·6 claims
- 0944US2010222487A1Inorganic hollow powder, process for producing the inorganic hollow powder, and composition comprising the inorganic hollow powderDENKI KAGAKU KOGYO KK·Filed 2007·Application pending·0 cites
- 1044US2023159725A1Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensorDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1143US8476340B2Ceramic powder and applications thereofNISHI YASUHISA·Filed 2011·Granted Jul 2, 2013·0 cites·7 claims
- 1240US8480990B2Silica powder, process for its production, and composition employing itSASAKI SYUJI·Filed 2008·Granted Jul 9, 2013·0 cites·7 claims
- 1335US8048817B2Amorphous silica powder, process for its production, and sealing material for semiconductorsDENKI KAGAKU KOGYO KK·Filed 2007·Granted Nov 1, 2011·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →