Inventor · disambiguated record
Craig T. Clyne
Also filed as: CLYNE CRAIG T
15 granted patents·126 citations·filing 1997–2012
93Inventor score
Top patents by PatentIndex Score
15 records- 0187US6071009ASemiconductor wirebond machine leadframe thermal map systemMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 6, 2000·54 cites·39 claims
- 0272US7518237B2Microfeature systems including adhered microfeature workpieces and support membersMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 14, 2009·5 cites·13 claims
- 0362US6352191B1Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 5, 2002·6 cites·29 claims
- 0460US6588649B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 8, 2003·5 cites·13 claims
- 0560US6375061B1Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·5 cites·13 claims
- 0660US6105846ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 22, 2000·15 cites·12 claims
- 0756US6447162B2Semiconductor wirebond machine leadframe thermal map systemMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 10, 2002·5 cites·53 claims
- 0854US6921017B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·3 cites·31 claims
- 0952US6138891ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·10 cites·29 claims
- 1051US6634538B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·4 cites·29 claims
- 1150US6126062ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 3, 2000·9 cites·13 claims
- 1249US6652138B2Semiconductor wire bond machine leadframe thermal map systemMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 25, 2003·3 cites·53 claims
- 1349US6273605B1Semiconductor wirebond machine leadframe thermal map systemMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 14, 2001·2 cites·48 claims
- 1446US9064973B2Die attached to a support member by a plurality of adhesive membersCLYNE CRAIG T·Filed 2012·Granted Jun 23, 2015·0 cites·20 claims
- 1541US8278751B2Methods of adhering microfeature workpieces, including a chip, to a support memberCLYNE CRAIG T·Filed 2005·Granted Oct 2, 2012·0 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →