Inventor · disambiguated record
Noriyuki Ohigashi
Also filed as: OHIGASHI NORIYUKI
3 granted patents·3 pending applications·13 citations·filing 2008–2011
65Inventor score
Top patents by PatentIndex Score
6 records- 0174US8318292B2Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2009·Granted Nov 27, 2012·5 cites·15 claims
- 0273US8969490B2Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2009·Granted Mar 3, 2015·3 cites·20 claims
- 0371US8357859B2Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminateSUMITOMO BAKELITE CO·Filed 2008·Granted Jan 22, 2013·5 cites·19 claims
- 0435US2012111621A1Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2010·Application pending·0 cites
- 0531US2011308848A1Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor deviceITO YUKA·Filed 2010·Application pending·0 cites
- 0627US2013105200A1Prepreg, wiring board, and semiconductor deviceOHIGASHI NORIYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →