Inventor · disambiguated record
Nae Hisano
Also filed as: HISANO NAE
12 granted patents·2 pending applications·185 citations·filing 2001–2023
89Inventor score
Top patents by PatentIndex Score
14 records- 0195US7119428B2Semiconductor deviceELPIDA MEMORY INC·Filed 2004·Granted Oct 10, 2006·109 cites·8 claims
- 0288US8704352B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2010·Granted Apr 22, 2014·11 cites·18 claims
- 0387US7432594B2Semiconductor chip, electrically connections thereforRENESAS TECH CORP·Filed 2005·Granted Oct 7, 2008·17 cites·18 claims
- 0483US6376905B2Semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 23, 2002·36 cites·4 claims
- 0578US7477520B2Memory moduleELPIDA MEMORY INC·Filed 2006·Granted Jan 13, 2009·8 cites·17 claims
- 0672US10522799B2Cell pack and container provided with sameHITACHI LTD·Filed 2013·Granted Dec 31, 2019·1 cites·12 claims
- 0768US8937390B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2014·Granted Jan 20, 2015·2 cites·2 claims
- 0862US12146481B2Gas compressorHITACHI LTD·Filed 2023·Granted Nov 19, 2024·0 cites·22 claims
- 0959US12123411B2Liquid-cooled rotary compressor and coolant supply method thereforHITACHI LTD·Filed 2023·Granted Oct 22, 2024·0 cites·10 claims
- 1058US7618847B2Bonding method of semiconductor and laminated structure fabricated therebyELPIDA MEMORY INC·Filed 2008·Granted Nov 17, 2009·1 cites·10 claims
- 1150US8334465B2Wafer of circuit board and joining structure of wafer or circuit boardISHINO MASAKAZU·Filed 2008·Granted Dec 18, 2012·0 cites·24 claims
- 1249US2013140067A1Wafer or circuit board and joining structure of wafer or circuit boardELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 1346US2009134498A1Semiconductor apparatusELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1437US7573128B2Semiconductor module in which a semiconductor package is bonded on a mount substrateHITACHI LTD·Filed 2004·Granted Aug 11, 2009·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →