Inventor · disambiguated record
Shinya Esaki
Also filed as: ESAKI SHINYA
11 granted patents·3 pending applications·40 citations·filing 2003–2022
84Inventor score
Top patents by PatentIndex Score
14 records- 0195US11198304B2Image-recording device having tank in communication with cartridge held by mount bodyBROTHER IND LTD·Filed 2020·Granted Dec 14, 2021·3 cites·14 claims
- 0287US12011932B2Image recording deviceBROTHER IND LTD·Filed 2021·Granted Jun 18, 2024·1 cites·12 claims
- 0382US11733933B2Image recording deviceBROTHER IND LTD·Filed 2021·Granted Aug 22, 2023·1 cites·9 claims
- 0479US6924540B2Integrated circuit device installed structure and installation methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 2, 2005·31 cites·6 claims
- 0568US7250664B2Integrated circuit device packaging structure and packaging methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 31, 2007·3 cites·16 claims
- 0660US7663200B2Integrated circuit device packaging structure and packaging methodPANASONIC CORP·Filed 2005·Granted Feb 16, 2010·1 cites·2 claims
- 0758US11999170B2Image recording device and computer readable mediumBROTHER IND LTD·Filed 2021·Granted Jun 4, 2024·0 cites·9 claims
- 0856US11740578B2Monitoring device, image recordation monitoring method, and printerBROTHER IND LTD·Filed 2022·Granted Aug 29, 2023·0 cites·18 claims
- 0953US11635922B2Image recording deviceBROTHER IND LTD·Filed 2021·Granted Apr 25, 2023·0 cites·7 claims
- 1052US11698764B2Image recording device, computer readable medium, and method to back up setting informationBROTHER IND LTD·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 1150US11989467B2Image recording deviceBROTHER IND LTD·Filed 2021·Granted May 21, 2024·0 cites·9 claims
- 1242US2005147011A1Optical integrated deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1340US2004217363A1Integrated circuit device packaging structure and packaging methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1439US2003197258A1Integrated circuit device packaging structure and packaging methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →