Inventor · disambiguated record
Anton Prueckl
Also filed as: PRUECKL ANTON
19 granted patents·1 pending application·90 citations·filing 2008–2015
93Inventor score
Top patents by PatentIndex Score
20 records- 0193US8120158B2Laminate electronic deviceEWE HENRIK·Filed 2009·Granted Feb 21, 2012·28 cites·15 claims
- 0287US8916968B2Multichip power semiconductor deviceMAHLER JOACHIM·Filed 2012·Granted Dec 23, 2014·8 cites·21 claims
- 0385US8648473B2Chip arrangement and a method for forming a chip arrangementPRUECKL ANTON·Filed 2012·Granted Feb 11, 2014·9 cites·26 claims
- 0481US8866274B2Semiconductor packages and methods of formation thereofGRUBER HERMANN·Filed 2012·Granted Oct 21, 2014·6 cites·46 claims
- 0581US8698298B2Laminate electronic deviceHENRIK EWE·Filed 2012·Granted Apr 15, 2014·9 cites·5 claims
- 0679US9576944B2Semiconductor devices with transistor cells and thermoresistive elementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·4 cites·25 claims
- 0778US8664043B2Method of manufacturing a laminate electronic device including separating a carrier into a plurality of partsEWE HENRIK·Filed 2009·Granted Mar 4, 2014·6 cites·25 claims
- 0874US8201326B2Method of manufacturing a semiconductor deviceEWE HENRIK·Filed 2008·Granted Jun 19, 2012·5 cites·20 claims
- 0970US8866302B2Device including two semiconductor chips and manufacturing thereofEWE HENRIK·Filed 2011·Granted Oct 21, 2014·3 cites·22 claims
- 1069US9123687B2Method of manufacturing a semiconductor deviceEWE HENRIK·Filed 2012·Granted Sep 1, 2015·2 cites·20 claims
- 1169US9059155B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 1269US8686569B2Die arrangement and method of forming a die arrangementDAECHE FRANK·Filed 2010·Granted Apr 1, 2014·4 cites·15 claims
- 1368US10020245B2Laminate electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 10, 2018·1 cites·20 claims
- 1465US9607966B2Chip arrangementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 28, 2017·1 cites·19 claims
- 1564US9437548B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 1661US8598694B2Chip-package having a cavity and a manufacturing method thereofHOSSEINI KHALIL·Filed 2011·Granted Dec 3, 2013·1 cites·24 claims
- 1755US9443760B2Multichip power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 13, 2016·0 cites·3 claims
- 1855US9018773B2Chip arrangement and a method for forming a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 28, 2015·0 cites·20 claims
- 1945US8847385B2Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip packageMAHLER JOACHIM·Filed 2012·Granted Sep 30, 2014·0 cites·25 claims
- 2035US2013341780A1Chip arrangements and a method for forming a chip arrangementSCHARF THORSTEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →