Inventor · disambiguated record
Byung-Ho Jun
Also filed as: JUN BYUNG HO
9 granted patents·15 pending applications·51 citations·filing 2006–2014
86Inventor score
Top patents by PatentIndex Score
24 records- 0192US7591872B1Method for producing silver nanoparticles and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·11 claims
- 0288US7744834B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 29, 2010·13 cites·17 claims
- 0385US8388725B2Apparatus and method for manufacturing metal nanoparticlesLEE YOUNG-IL·Filed 2010·Granted Mar 5, 2013·5 cites·7 claims
- 0480US7935170B2Method for manufacturing copper-based nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted May 3, 2011·4 cites·11 claims
- 0575US9330847B2Conductive paste for external electrodes and multilayer ceramic electronic component manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 3, 2016·2 cites·14 claims
- 0673US7988761B2Method for manufacturing metal nanoparticles comprising rod-shaped nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 2, 2011·3 cites·17 claims
- 0772US8389601B2Inkjet ink compositionKIM TAE-HOON·Filed 2009·Granted Mar 5, 2013·1 cites·4 claims
- 0861US7867316B2Method of manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 11, 2011·6 cites·12 claims
- 0957US7935169B2Apparatus and method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted May 3, 2011·4 cites·13 claims
- 1053US2015103464A1Static-protective component and static-protective compositionSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1152US2012220072A1Copper nano paste, method for forming the copper nano paste, and method for forming electrode using the copper nano pasteKIM DONG HOON·Filed 2011·Application pending·0 cites
- 1250US2012060912A1Method of forming conductive electrode structure and method of manufacturing solar cell with the same, and solar cell manufactured by the method of manufacturing solar cellCHO SU HWAN·Filed 2011·Application pending·0 cites
- 1350US2006203423A1Multi-layer ceramic capacitor and production method thereofLEE KWI-JONG·Filed 2006·Application pending·0 cites
- 1448US2008138643A1Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1548US2008282537A1Wiring forming method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1647US2007275259A1Method of producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1746US2011318541A1Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink compositionKIM TAE HOON·Filed 2010·Application pending·0 cites
- 1846US2012219787A1Conductive metal paste composition and method of manufacturing the sameJUN BYUNG HO·Filed 2011·Application pending·0 cites
- 1946US2006254387A1Metal nano particle and method for manufacturing them and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2046US2010051329A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2145US2006261316A1Conductive ink, preparation method thereof and conductive boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2243US2006208230A1Method for manufacturing printed circuit board using Ag-Pd alloy nanoparticlesCHO HYE-JIN·Filed 2006·Application pending·0 cites
- 2342US2011315436A1Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink compositionKIM TAE HOON·Filed 2010·Application pending·0 cites
- 2433US2013332029A1Method and apparatus for controlling failure of motor-driven power steering systemHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →