Inventor · disambiguated record
Morio Nakao
Also filed as: NAKAO MORIO
3 granted patents·2 pending applications·92 citations·filing 1997–2005
74Inventor score
Files withIBIDEN CO LTD3
Top patents by PatentIndex Score
5 records- 0187US7568922B2Printed wiring board having a solder pad and a method for manufacturing the sameIBIDEN CO LTD·Filed 2005·Granted Aug 4, 2009·17 cites·17 claims
- 0276US6232558B1Electronic component mounting base board having heat slug with slits and projectionsIBIDEN CO LTD·Filed 1998·Granted May 15, 2001·53 cites·7 claims
- 0362US5914859AElectronic component mounting base board and method of producing the sameIBIDEN CO LTD·Filed 1997·Granted Jun 22, 1999·22 cites·12 claims
- 0430US2005023682A1High reliability chip scale packageFiled 2003·Application pending·0 cites
- 0527US2004036172A1Semiconductor device package with integrated heatspreaderFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →