Inventor · disambiguated record
Chi-Fa Lin
Also filed as: LIN CHI-FA
13 granted patents·1 pending application·599 citations·filing 1998–1999
94Inventor score
Files withWINBOND ELECTRONICS CORP13
Top patents by PatentIndex Score
14 records- 0195US5920792AHigh density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layersWINBOND ELECTRONICS CORP·Filed 1998·Granted Jul 6, 1999·285 cites·11 claims
- 0288US6277757B1Methods to modify wet by dry etched via profileWINBOND ELECTRONICS CORP·Filed 1999·Granted Aug 21, 2001·107 cites·20 claims
- 0368US6477447B1Methods to generate numerical pressure distribution data for developing pressure related componentsWINBOND ELECTRONICS CORP·Filed 1999·Granted Nov 5, 2002·34 cites·23 claims
- 0466US5969409ACombined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded thereinWINBOND ELECTRONICS CORP·Filed 1999·Granted Oct 19, 1999·28 cites·6 claims
- 0561US6165886AAdvanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effectWINBOND ELECTRONICS CORP·Filed 1998·Granted Dec 26, 2000·26 cites·9 claims
- 0659US6180997B1Structure for a multi-layered dielectric layer and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 1999·Granted Jan 30, 2001·21 cites·20 claims
- 0757US6307268B1Suppression of interconnect stress migration by refractory metal plugWINBOND ELECTRONICS CORP·Filed 1999·Granted Oct 23, 2001·22 cites·16 claims
- 0855US6235608B1STI process by method of in-situ multilayer dielectric depositionWINBOND ELECTRONICS CORP·Filed 1999·Granted May 22, 2001·19 cites·12 claims
- 0955US5946592ACombined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded thereinWINBOND ELECTRONICS CORP·Filed 1998·Granted Aug 31, 1999·18 cites·11 claims
- 1053US6441465B2Scribe line structure for preventing from damages thereof induced during fabricationWINBOND ELECTRONICS CORP·Filed 1999·Granted Aug 27, 2002·19 cites·4 claims
- 1152US6033987AMethod for mapping and adjusting pressure distribution of CMP processesWINBOND ELECTRONICS CORP·Filed 1999·Granted Mar 7, 2000·18 cites·14 claims
- 1230US6323122B2Structure for a multi-layered dielectric layer and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 1998·Granted Nov 27, 2001·1 cites·23 claims
- 1330US6204551B1Modified SOG coater's hot plate to improve SOG film qualityWINBOND ELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·1 cites·10 claims
- 1430US2001042903A1Inter-metal dielectric layer structure and its forming methodFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →