Inventor · disambiguated record
Wu-An Weng
Also filed as: WENG WU-AN
12 granted patents·3 pending applications·73 citations·filing 1995–2025
89Inventor score
Top patents by PatentIndex Score
15 records- 0193US11961770B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·3 cites·20 claims
- 0290US10490463B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·7 cites·20 claims
- 0385US9472690B2Deep trench capacitor manufactured by streamlined processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 0479US9972771B2MRAM devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 15, 2018·3 cites·18 claims
- 0574US9012296B2Self-aligned deep trench capacitor, and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Apr 21, 2015·4 cites·18 claims
- 0673US11171065B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·1 cites·20 claims
- 0773US2025316569A1Surface treatment in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0871US7795644B2Integrated circuits with stress memory effect and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 14, 2010·5 cites·12 claims
- 0970US8853048B2Streamlined process for vertical semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 7, 2014·3 cites·19 claims
- 1069US2025062201A1Surface treatment in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1160US2025372536A1Back-side warpage control layer to improve bonding bulge / non-bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1259US5691216AIntegrated circuit self-aligning process and apparatusMACRONIX INT CO LTD·Filed 1995·Granted Nov 25, 1997·19 cites·15 claims
- 1353US5621697AHigh density integrated circuit with bank select structureMACRONIX INT CO LTD·Filed 1995·Granted Apr 15, 1997·17 cites·31 claims
- 1450US7141179B2Monitoring semiconductor wafer defects below one nanometerMACRONIX INT CO LTD·Filed 2004·Granted Nov 28, 2006·2 cites·29 claims
- 1535US7041565B2Method for fabricating a capacitor in a semiconductor deviceMACRONIX INT CO LTD·Filed 2004·Granted May 9, 2006·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →