Inventor · disambiguated record
Chia-Han Lin
Also filed as: LIN CHIA HAN
10 granted patents·2 pending applications·96 citations·filing 2007–2022
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5JARLLYTEC CO LTD3CHANG CHING HUI1FANG WEI-LEUN1LIN CHIA-HAN1
Top patents by PatentIndex Score
12 records- 0193US11961770B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·3 cites·20 claims
- 0292US7597302B2Elevation-adjustable support structureJARLLYTEC CO LTD·Filed 2007·Granted Oct 6, 2009·47 cites·15 claims
- 0390US10490463B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·7 cites·20 claims
- 0483US8060985B2Hinge structure with changeable frictional facesLIN CHIA-HAN·Filed 2008·Granted Nov 22, 2011·21 cites·12 claims
- 0580US10821871B2Method for transferring containerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 3, 2020·3 cites·20 claims
- 0673US11171065B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·1 cites·20 claims
- 0767US9077095B2Insertion device having recovering mechanismJARLLYTEC CO LTD·Filed 2013·Granted Jul 7, 2015·4 cites·5 claims
- 0867US7731137B2Vertically adjustable supporting structureJARLLYTEC CO LTD·Filed 2007·Granted Jun 8, 2010·10 cites·13 claims
- 0963US11447054B2Method for transferring containerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 1041US2023135496A1Test method and systemREALTEK SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 1131US8679974B2Method for fabricating interconnecting lines inside via holes of semiconductor deviceFANG WEI-LEUN·Filed 2012·Granted Mar 25, 2014·0 cites·11 claims
- 1230US2013299955A1Film based ic packaging method and a packaged ic deviceCHANG CHING HUI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →