Inventor · disambiguated record
Yuya Okimura
Also filed as: OKIMURA Yuya
3 granted patents·4 pending applications·3 citations·filing 2014–2020
54Inventor score
Files withTOAGOSEI CO LTD7
Top patents by PatentIndex Score
7 records- 0184US10471682B2Adhesive composition and laminate with adhesive layer using sameTOAGOSEI CO LTD·Filed 2015·Granted Nov 12, 2019·2 cites·21 claims
- 0271US10875283B2Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using sameTOAGOSEI CO LTD·Filed 2015·Granted Dec 29, 2020·1 cites·23 claims
- 0355US2022259427A1Resin composition, layered body including resin composition layer, layered body, and electromagnetic wave shielding filmTOAGOSEI CO LTD·Filed 2020·Application pending·0 cites
- 0454US10472496B2Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminateTOAGOSEI CO LTD·Filed 2014·Granted Nov 12, 2019·0 cites·19 claims
- 0554US2022306859A1Resin composition, bonding film, layered body including resin composition layer, layered body, and electromagnetic wave shielding filmTOAGOSEI CO LTD·Filed 2020·Application pending·0 cites
- 0652US2021009865A1Adhesive composition, and adhesive layer-equipped layered product using sameTOAGOSEI CO LTD·Filed 2019·Application pending·0 cites
- 0751US2022411630A1Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding filmTOAGOSEI CO LTD·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuya Okimura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →