Inventor · disambiguated record
Shinsuke Sakai
Also filed as: SAKAI SHINSUKE
6 granted patents·3 pending applications·150 citations·filing 1986–2022
84Inventor score
Files withNAKASHIMADA YUTAKA2MITSUBISHI MATERIAL SILICON1MITSUBISHI METAL CORP1NEC CORP1NIPPON KAIJI KYOKAI1
Top patents by PatentIndex Score
9 records- 0175US5096854AMethod for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 micronsNIPPON SILICONE KK·Filed 1989·Granted Mar 17, 1992·47 cites·15 claims
- 0265US6199680B1Method and apparatus for bunching PTPs and for transferring the bunched-PTPsOMORI MACHINERY·Filed 1999·Granted Mar 13, 2001·24 cites·8 claims
- 0363US5459104AProcess for production of semiconductor substrateMITSUBISHI MATERIAL SILICON·Filed 1994·Granted Oct 17, 1995·36 cites·9 claims
- 0458US5337232AMorpheme analysis deviceNEC CORP·Filed 1992·Granted Aug 9, 1994·38 cites·6 claims
- 0552US2009299696A1Damage probability calculating apparatus, damage probability calculating method, maintenance method, and damage probability calculating programNIPPON KAIJI KYOKAI·Filed 2008·Application pending·0 cites
- 0649US2025144845A1Semiconductor Crystal Wafer Manufacturing Device and Manufacturing MethodSUCCESS CO LTD·Filed 2022·Application pending·0 cites
- 0734US4699118AApparatus for dressing cutting edgeMITSUBISHI METAL CORP·Filed 1986·Granted Oct 13, 1987·5 cites·4 claims
- 0833US9181557B2Uracil-requiring moorella bacteria and transforming-gene-introduced moorella bacteriaNAKASHIMADA YUTAKA·Filed 2012·Granted Nov 10, 2015·0 cites·2 claims
- 0929US2014206084A1Primer Set and Method for Homologous RecombinationNAKASHIMADA YUTAKA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →