Inventor · disambiguated record
Lewis D. Lipschutz
Also filed as: LIPSCHUTZ LEWIS D
7 granted patents·208 citations·filing 1981–1988
87Inventor score
Technology areasH10W
Files withIBM7
Top patents by PatentIndex Score
7 records- 0187US4498530AFlexible thermal conduction element for cooling semiconductor devicesIBM·Filed 1981·Granted Feb 12, 1985·75 cites·10 claims
- 0281US4442450ACooling element for solder bonded semiconductor devicesIBM·Filed 1981·Granted Apr 10, 1984·59 cites·7 claims
- 0369US4483389ATelescoping thermal conduction element for semiconductor devicesIBM·Filed 1982·Granted Nov 20, 1984·31 cites·12 claims
- 0461US4500945ADirectly sealed multi-chip moduleIBM·Filed 1982·Granted Feb 19, 1985·24 cites·9 claims
- 0542US4747533ABonding method and apparatusIBM·Filed 1986·Granted May 31, 1988·12 cites·19 claims
- 0634US4611746AProcess for forming improved solder connections for semiconductor devices with enhanced fatigue lifeIBM·Filed 1984·Granted Sep 16, 1986·5 cites·6 claims
- 0728US4805831ABonding methodIBM·Filed 1988·Granted Feb 21, 1989·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →