Inventor · disambiguated record
Naoto Kameda
Also filed as: KAMEDA NAOTO
13 granted patents·4 pending applications·6 citations·filing 2007–2023
83Inventor score
Files withMEIDENSHA ELECTRIC MFG CO LTD7SENJU METAL INDUSTRY CO7MEIDEN NANOPROCESS INNOVATIONS INC2NISHIGUCHI TETSUYA1
Top patents by PatentIndex Score
17 records- 0184US10137538B2Liquid coating deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Nov 27, 2018·3 cites·13 claims
- 0283US11414755B2Atomic layer deposition method and atomic layer deposition deviceMEIDENSHA ELECTRIC MFG CO LTD·Filed 2019·Granted Aug 16, 2022·1 cites·13 claims
- 0373US2022364235A1Atomic layer deposition method and atomic layer deposition deviceMEIDENSHA ELECTRIC MFG CO LTD·Filed 2022·Application pending·0 cites
- 0471US10978293B2Oxide film formation methodMEIDENSHA ELECTRIC MFG CO LTD·Filed 2018·Granted Apr 13, 2021·1 cites·22 claims
- 0567US10391589B2Flux applying deviceSENJU METAL INDUSTRY CO·Filed 2015·Granted Aug 27, 2019·1 cites·4 claims
- 0660US12080671B2Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2022·Granted Sep 3, 2024·0 cites·18 claims
- 0758US11560622B2Degradable resin molding and production method for degradable resin moldingMEIDENSHA ELECTRIC MFG CO LTD·Filed 2019·Granted Jan 24, 2023·0 cites·5 claims
- 0857US11512177B2Reforming device and reforming method for porous materialMEIDENSHA ELECTRIC MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·5 claims
- 0954US11712760B2Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 1, 2023·0 cites·29 claims
- 1054US2025379173A1Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2023·Application pending·0 cites
- 1151US2019358751A1Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1250US11680319B2Atomic layer deposition device and atomic layer deposition methodMEIDENSHA ELECTRIC MFG CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·14 claims
- 1347US12448684B2Oxide film formation methodMEIDEN NANOPROCESS INNOVATIONS INC·Filed 2023·Granted Oct 21, 2025·0 cites·7 claims
- 1445US11306396B2Oxide film forming deviceMEIDENSHA ELECTRIC MFG CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·4 claims
- 1541US9956634B2Device for coating thin molten solder film, thin solder film-covered component and manufacturing method thereforSENJU METAL INDUSTRY CO·Filed 2013·Granted May 1, 2018·0 cites·5 claims
- 1641US8163659B2Method for oxide film formation and apparatus for the methodNISHIGUCHI TETSUYA·Filed 2007·Granted Apr 24, 2012·0 cites·12 claims
- 1736US2024060179A1Atomic layer deposition device and atomic layer deposition methodMEIDEN NANOPROCESS INNOVATIONS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →