Inventor · disambiguated record
Masahiro Miyasaka
Also filed as: MIYASAKA MASAHIRO
11 granted patents·3 pending applications·81 citations·filing 1997–2014
87Inventor score
Top patents by PatentIndex Score
14 records- 0177US5867622AModule for optical communicationKYOCERA CORP·Filed 1997·Granted Feb 2, 1999·60 cites·16 claims
- 0275US8198008B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 12, 2012·7 cites·13 claims
- 0367US10104781B2Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2014·Granted Oct 16, 2018·2 cites·10 claims
- 0463US8105759B2Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the compositionMIYASAKA MASAHIRO·Filed 2006·Granted Jan 31, 2012·2 cites·2 claims
- 0563US7993809B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 9, 2011·1 cites·10 claims
- 0662US8592130B2Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring boardMIYASAKA MASAHIRO·Filed 2009·Granted Nov 26, 2013·1 cites·7 claims
- 0759US7736834B2Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured productHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jun 15, 2010·5 cites·17 claims
- 0858US8501392B2Photosensitive element, method for formation of resist pattern, and method for production of print circuit boardSAITOU MANABU·Filed 2007·Granted Aug 6, 2013·2 cites·10 claims
- 0943US2015293443A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1043US2010233627A1Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panelHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 1142US7622243B2Photosensitive element, resist pattern formation method and printed wiring board production methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 24, 2009·1 cites·19 claims
- 1240US8192916B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 5, 2012·0 cites·16 claims
- 1334US2013298398A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring boardMIYASAKA MASAHIRO·Filed 2011·Application pending·0 cites
- 1433US8586284B2Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring boardNANKAWA HANAKO·Filed 2008·Granted Nov 19, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →