Inventor · disambiguated record
Naomi Fukumaki
Also filed as: FUKUMAKI NAOMI
14 granted patents·4 pending applications·7 citations·filing 2002–2022
84Inventor score
Files withKIOXIA CORP7NEC ELECTRONICS CORP4TOSHIBA MEMORY CORP4FUKUMAKI NAOMI1RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
18 records- 0175US10590532B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Mar 17, 2020·2 cites·10 claims
- 0272US12016182B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2022·Granted Jun 18, 2024·0 cites·8 claims
- 0366US12448688B2Film forming method and apparatusKIOXIA CORP·Filed 2022·Granted Oct 21, 2025·0 cites·10 claims
- 0466US11515323B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2020·Granted Nov 29, 2022·0 cites·12 claims
- 0565US10304743B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2016·Granted May 28, 2019·1 cites·1 claims
- 0659US12040228B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2021·Granted Jul 16, 2024·0 cites·4 claims
- 0756US2009217873A1Atomic layer deposition apparatusNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0854US6773506B2Method for producing thin filmNEC ELECTRONICS CORP·Filed 2002·Granted Aug 10, 2004·4 cites·16 claims
- 0953US2021082753A1Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2020·Application pending·0 cites
- 1051US12327787B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Jun 10, 2025·0 cites·8 claims
- 1149US9379178B2Manufacturing method of semiconductor device comprising a capacitor elementRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·0 cites·6 claims
- 1246US2023064038A1Semiconductor device and semiconductor memory device, and method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1344US10825770B2Semiconductor device having a stack body including metal films and first insulating films alternately stacked on a semiconductor substrate and including a stepped end portion and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2019·Granted Nov 3, 2020·0 cites·6 claims
- 1442US9142609B2MIM capacitor deviceYAMAMOTO YOUICHI·Filed 2011·Granted Sep 22, 2015·0 cites·21 claims
- 1541US7608502B2Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Oct 27, 2009·0 cites·10 claims
- 1639US10096485B2Semiconductor device and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2015·Granted Oct 9, 2018·0 cites·4 claims
- 1738US2006017090A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1831US8440521B2Method of manufacturing a semiconductor deviceFUKUMAKI NAOMI·Filed 2011·Granted May 14, 2013·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →