Inventor · disambiguated record
Kosuke Wakamatsu
Also filed as: WAKAMATSU KOSUKE
6 granted patents·3 pending applications·12 citations·filing 2008–2022
73Inventor score
Top patents by PatentIndex Score
9 records- 0183US8029111B2Droplet ejection head and droplet ejection apparatusSEIKO EPSON CORP·Filed 2008·Granted Oct 4, 2011·7 cites·33 claims
- 0274US9327500B2Nozzle plate, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted May 3, 2016·2 cites·12 claims
- 0365US8936355B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Jan 20, 2015·1 cites·8 claims
- 0461US8128202B2Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge deviceMATSUO YASUHIDE·Filed 2009·Granted Mar 6, 2012·2 cites·29 claims
- 0555US2010151231A1Bonded body and bonding methodSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 0655US2010323193A1Base member including bonding film, bonding method and bonded bodySEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 0755US2010323192A1Base member including bonding film, bonding method and bonded bodySEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 0842US12149593B2Communication apparatus, server, communication system, and communication methodDAIKIN IND LTD·Filed 2022·Granted Nov 19, 2024·0 cites·8 claims
- 0942US8029110B2Droplet ejection head and droplet ejection apparatusSEIKO EPSON CORP·Filed 2008·Granted Oct 4, 2011·0 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →