Inventor · disambiguated record
Ting-Yu Pai
Also filed as: PAI TING-YU
14 granted patents·11 pending applications·32 citations·filing 2018–2025
87Inventor score
Files withWIWYNN CORP25
Top patents by PatentIndex Score
25 records- 0192US12075599B2Electronic apparatus, immersion cooling system and liquid amount adjusting moduleWIWYNN CORP·Filed 2021·Granted Aug 27, 2024·4 cites·23 claims
- 0290US12089369B2Separate immersion cooling device and separate immersion cooling system having the sameWIWYNN CORP·Filed 2022·Granted Sep 10, 2024·2 cites·19 claims
- 0390US11375638B2Immersion cooling apparatusWIWYNN CORP·Filed 2020·Granted Jun 28, 2022·14 cites·4 claims
- 0488US10881020B1Immersion cooling module and electronic apparatus having the sameWIWYNN CORP·Filed 2019·Granted Dec 29, 2020·6 cites·20 claims
- 0583US2025358966A1Immersion cooling system and electronic apparatus having the same and pressure adjusting moduleWIWYNN CORP·Filed 2025·Application pending·0 cites
- 0682US12408299B2Immersion cooling system and electronic apparatus having the same and pressure adjusting moduleWIWYNN CORP·Filed 2021·Granted Sep 2, 2025·1 cites·6 claims
- 0781US11740669B2Electronic apparatus having immersion cooling system and operating method thereofWIWYNN CORP·Filed 2021·Granted Aug 29, 2023·1 cites·17 claims
- 0878US10398022B1Adjustable fixing device for a heat dissipating component and related electronic apparatusWIWYNN CORP·Filed 2019·Granted Aug 27, 2019·4 cites·20 claims
- 0976US2024349452A1Electronic apparatus, cooling system and liquid amount adjusting moduleWIWYNN CORP·Filed 2024·Application pending·0 cites
- 1068US2025040039A1Package assemblyWIWYNN CORP·Filed 2024·Application pending·0 cites
- 1167US12439568B2Immersion liquid cooling equipment and heat dissipation method for electronic deviceWIWYNN CORP·Filed 2023·Granted Oct 7, 2025·0 cites·21 claims
- 1263US12426207B2Immersion fluid module and server systemWIWYNN CORP·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1363US12414268B2Immersion cooling systemWIWYNN CORP·Filed 2023·Granted Sep 9, 2025·0 cites·21 claims
- 1461US12150243B2Package assemblyWIWYNN CORP·Filed 2022·Granted Nov 19, 2024·0 cites·12 claims
- 1558US2024367178A1Electro-filtration devices, cooling systems, and method for cooling electronic componentsWIWYNN CORP·Filed 2023·Application pending·0 cites
- 1657US2025063692A1Immersion cooling systemWIWYNN CORP·Filed 2024·Application pending·0 cites
- 1757US2024381575A1Electronic apparatus and cooling system for heat dissipation of heat generating componentWIWYNN CORP·Filed 2024·Application pending·0 cites
- 1855US11665864B2Immersion cooling system and electronic apparatus having the sameWIWYNN CORP·Filed 2021·Granted May 30, 2023·0 cites·24 claims
- 1955US2025220855A1Gas cooling module for immersion electronic apparatus and test device equipped with gas cooling moduleWIWYNN CORP·Filed 2024·Application pending·0 cites
- 2050US2025081404A1Server system and heat dissipation moduleWIWYNN CORP·Filed 2024·Application pending·0 cites
- 2150US2024015926A1Immersion cooling systemWIWYNN CORP·Filed 2023·Application pending·0 cites
- 2250US2024015930A1Immersion cooling systemWIWYNN CORP·Filed 2023·Application pending·0 cites
- 2350US2024015929A1Immersion cooling systemWIWYNN CORP·Filed 2023·Application pending·0 cites
- 2449US12363861B2Flow dividing device and immersion cooling system having the sameWIWYNN CORP·Filed 2022·Granted Jul 15, 2025·0 cites·7 claims
- 2547US11039554B2Electronic apparatus with a temperature sensorWIWYNN CORP·Filed 2018·Granted Jun 15, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →