Inventor · disambiguated record
Yuji Morinaga
Also filed as: MORINAGA YUJI
14 granted patents·11 pending applications·12 citations·filing 2014–2025
85Inventor score
Files withSHINDENGEN ELECTRIC MFG25
Top patents by PatentIndex Score
25 records- 0184US10083844B2Method of manufacturing bonded bodySHINDENGEN ELECTRIC MFG·Filed 2015·Granted Sep 25, 2018·6 cites·5 claims
- 0271US10243477B2Semiconductor device having a bypass capacitorSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Mar 26, 2019·2 cites·13 claims
- 0366US10615092B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 7, 2020·1 cites·6 claims
- 0461US10319704B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Jun 11, 2019·1 cites·12 claims
- 0560US9704828B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2014·Granted Jul 11, 2017·1 cites·2 claims
- 0659US10159166B2Heat dissipating structureSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Dec 18, 2018·1 cites·9 claims
- 0759US2024312921A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0859US2024347466A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 0959US2024312922A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1057US2025300653A1Semiconductor circuitSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1157US2025140652A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1257US2025140656A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1355US2025183218A1Electrical connecting member and semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2023·Application pending·0 cites
- 1455US2024379572A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1553US2025239532A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2023·Application pending·0 cites
- 1647US2025309023A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1747US2025309206A1Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1844US10251256B2Heat dissipating structureSHINDENGEN ELECTRIC MFG·Filed 2014·Granted Apr 2, 2019·0 cites·6 claims
- 1941US11404353B2Electronic device, connection body, and manufacturing method for electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Aug 2, 2022·0 cites·5 claims
- 2040US10910292B2Electronic device and connection bodySHINDENGEN ELECTRIC MFG·Filed 2017·Granted Feb 2, 2021·0 cites·6 claims
- 2139US10600712B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Mar 24, 2020·0 cites·6 claims
- 2238US11211311B2Electronic device and connection bodySHINDENGEN ELECTRIC MFG·Filed 2017·Granted Dec 28, 2021·0 cites·5 claims
- 2336US10896868B2Electronic device and connectorSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jan 19, 2021·0 cites·7 claims
- 2435US10199486B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Feb 5, 2019·0 cites·12 claims
- 2534US10461042B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Oct 29, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →