Inventor · disambiguated record
Hiromi Denda
Also filed as: DENDA HIROMI
2 granted patents·10 citations·filing 2012–2013
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0179US9232642B2Wiring substrate, method for manufacturing the wiring substrate, and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 5, 2016·6 cites·7 claims
- 0271US9236334B2Wiring substrate and method for manufacturing wiring substratesKANEKO KENTARO·Filed 2012·Granted Jan 12, 2016·4 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Hiromi Denda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →