Inventor · disambiguated record
Etsuo Ohkawado
Also filed as: OHKAWADO ETSUO
7 granted patents·1 pending application·371 citations·filing 1988–2008
84Inventor score
Top patents by PatentIndex Score
8 records- 0194US5406124AInsulating adhesive tape, and lead frame and semiconductor device employing the tapeMITSUI TOATSU CHEMICALS·Filed 1993·Granted Apr 11, 1995·318 cites·16 claims
- 0284US4978754APreparation process of unsaturated carboxylic acid amideMITSUI TOATSU CHEMICALS·Filed 1988·Granted Dec 18, 1990·34 cites·17 claims
- 0376US7851124B2Composition for forming wiring protective film and uses thereofMITSUI CHEMICALS INC·Filed 2005·Granted Dec 14, 2010·7 cites·15 claims
- 0471US7030170B2Photosensitive resin composition, dry film, and workpiece using the sameMITSUI CHEMICALS INC·Filed 2002·Granted Apr 18, 2006·12 cites·7 claims
- 0552US8362103B2Resin composition, dry film, and processed product made using the sameMITSUI CHEMICALS INC·Filed 2008·Granted Jan 29, 2013·0 cites·13 claims
- 0650US2004247908A1Composition for forming wiring protective film and uses thereofMITSUI CHEMICALS INC·Filed 2004·Application pending·0 cites
- 0741US8361605B2Photosensitive resin composition, dry film, and processed product made using the sameMITSUI CHEMICALS INC·Filed 2008·Granted Jan 29, 2013·0 cites·14 claims
- 0837US8409784B2Photosensitive resin composition, dry film, and processed product made using the sameFUNAKI KATSUHIKO·Filed 2008·Granted Apr 2, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →