Inventor · disambiguated record
Kun-Mo Chu
Also filed as: CHU KUN MO
9 granted patents·5 pending applications·13 citations·filing 2011–2014
81Inventor score
Top patents by PatentIndex Score
14 records- 0178US9000473B2Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation materialLEE EUN SUNG·Filed 2011·Granted Apr 7, 2015·4 cites·8 claims
- 0277US9501013B2Heating member and fusing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 22, 2016·2 cites·21 claims
- 0375US9165701B2Resistance heating element and heating member and fusing device employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 20, 2015·3 cites·18 claims
- 0470US9052655B2Heating member including a base polymer and fusing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 9, 2015·1 cites·22 claims
- 0569US9348280B2Heating composite, and heating apparatus and fusing apparatus including the sameLEE SANG-EUI·Filed 2012·Granted May 24, 2016·2 cites·10 claims
- 0658US9272902B2Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the sameKIM DONG-OUK·Filed 2012·Granted Mar 1, 2016·1 cites·28 claims
- 0756US9516739B2Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation materialLEE EUN SUNG·Filed 2014·Granted Dec 6, 2016·0 cites·15 claims
- 0856US9037063B2Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating memberSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 19, 2015·0 cites·20 claims
- 0951US9002253B2Heating member and fusing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 7, 2015·0 cites·20 claims
- 1047US2014299231A1Metal-based solder composite including conductive self-healing materialsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1145US2013115420A1Nano composite with superhydrophobic surface and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1245US2012181004A1Surface coating layer and heat exchanger including the surface coating layerSON YOON CHUL·Filed 2011·Application pending·0 cites
- 1341US2014072353A1Fusing apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1436US2012207525A1Resistance heating composition and heating composite, heating apparatus, and fusing apparatus, including resistance heating compositionKIM DONG-OUK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →