Inventor · disambiguated record
Holger J. Koenigsmann
Also filed as: KOENIGSMANN HOLGER · KOENIGSMANN HOLGER J
14 granted patents·3 pending applications·397 citations·filing 1996–2012
93Inventor score
Top patents by PatentIndex Score
17 records- 0196US7081148B2Textured-grain-powder metallurgy tantalum sputter targetPRAXAIR TECHNOLOGY INC·Filed 2004·Granted Jul 25, 2006·53 cites·14 claims
- 0293US6770154B2Textured-grain-powder metallurgy tantalum sputter targetPRAXAIR TECHNOLOGY INC·Filed 2001·Granted Aug 3, 2004·74 cites·11 claims
- 0392US6708870B2Method for forming sputter target assembliesPRAXAIR TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·55 cites·9 claims
- 0489US6599405B2Recessed sputter targetPRAXAIR TECHNOLOGY INC·Filed 2001·Granted Jul 29, 2003·39 cites·12 claims
- 0589US6478902B2Fabrication and bonding of copper sputter targetsPRAXAIR TECHNOLOGY INC·Filed 2000·Granted Nov 12, 2002·43 cites·17 claims
- 0688US6652668B1High-purity ferromagnetic sputter targets and method of manufacturePRAXAIR TECHNOLOGY INC·Filed 2002·Granted Nov 25, 2003·23 cites·14 claims
- 0785US5985212AHigh strength lead-free solder materialsTECHNOLOGIES GROUP INC H·Filed 1996·Granted Nov 16, 1999·59 cites·1 claims
- 0875US6176944B1Method of making low magnetic permeability cobalt sputter targetsPRAXAIR TECHNOLOGY INC·Filed 1999·Granted Jan 23, 2001·31 cites·14 claims
- 0970US6988306B2High purity ferromagnetic sputter target, assembly and method of manufacturing samePRAXAIR TECHNOLOGY INC·Filed 2003·Granted Jan 24, 2006·14 cites·14 claims
- 1063US8342383B2Method for forming sputter target assemblies having a controlled solder thicknessPRAXAIR TECHNOLOGY INC·Filed 2006·Granted Jan 1, 2013·3 cites·13 claims
- 1153US6478895B1Nickel-titanium sputter target alloyPRAXAIR TECHNOLOGY INC·Filed 2001·Granted Nov 12, 2002·1 cites·14 claims
- 1251US2010012488A1Sputter target assembly having a low-temperature high-strength bondKOENIGSMANN HOLGER J·Filed 2008·Application pending·0 cites
- 1348US8993122B2Method for forming sputter target assemblies having a controlled solder thicknessGILMAN PAUL S·Filed 2012·Granted Mar 31, 2015·0 cites·15 claims
- 1446US7608172B2High-purity ferromagnetic sputter targets and method of manufacturePRAXAIR TECHNOLOGY INC·Filed 2003·Granted Oct 27, 2009·0 cites·3 claims
- 1541US8123107B2Method for forming sputter target assembliesKOENIGSMANN HOLGER J·Filed 2004·Granted Feb 28, 2012·2 cites·4 claims
- 1641US2005051606A1Method of manufacturing an extended life sputter target assembly and product thereofFiled 2003·Application pending·0 cites
- 1738US2005061857A1Method for bonding a sputter target to a backing plate and the assembly thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →