Inventor · disambiguated record
Young-Hee Song
Also filed as: SONG YOUNG H · SONG YOUNG-HEE
58 granted patents·18 pending applications·1,658 citations·filing 1993–2016
99Inventor score
Top patents by PatentIndex Score
76 records- 0199US7215033B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·422 cites·11 claims
- 0297US7317247B2Semiconductor package having heat spreader and package stack using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 8, 2008·31 cites·62 claims
- 0397US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0495US6483038B2Memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 19, 2002·142 cites·16 claims
- 0592US7368821B2BGA semiconductor chip package and mounting structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·26 cites·20 claims
- 0692USD432096SSemiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 17, 2000·48 cites·1 claims
- 0791US6849802B2Semiconductor chip, chip stack package and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·56 cites·15 claims
- 0890US10474192B2Wearable smart device having flexible semiconductor package mounted on a bandSONG YOUNG HEE·Filed 2016·Granted Nov 12, 2019·20 cites·10 claims
- 0990US7453159B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·14 cites·24 claims
- 1090US6724074B2Stack semiconductor chip package and lead frameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 20, 2004·66 cites·27 claims
- 1190USD432097SSemiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 17, 2000·42 cites·1 claims
- 1288US7307342B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·16 cites·19 claims
- 1388US7208343B2Semiconductor chip, chip stack package and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 24, 2007·42 cites·11 claims
- 1487US6852607B2Wafer level package having a side packageSAMSUNG ELECTRONIC·Filed 2002·Granted Feb 8, 2005·58 cites·13 claims
- 1587US6445077B1Semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 3, 2002·45 cites·16 claims
- 1686US7576440B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·9 cites·20 claims
- 1785US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 1883US8987022B2Light-emitting device package and method of manufacturing the sameYOO CHEOL-JUN·Filed 2012·Granted Mar 24, 2015·7 cites·23 claims
- 1983US7821127B2Semiconductor device package having buffered memory module and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 26, 2010·10 cites·20 claims
- 2080US8710513B2Light-emitting device package and method of manufacturing the sameYOO CHEOL-JUN·Filed 2012·Granted Apr 29, 2014·5 cites·25 claims
- 2180US8638037B2Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device packageMOON KYUNG-MI·Filed 2011·Granted Jan 28, 2014·5 cites·39 claims
- 2279US7541682B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·5 cites·14 claims
- 2378US8840265B2Illumination apparatus employing light-emitting device packageMOON KYUNG-MI·Filed 2011·Granted Sep 23, 2014·5 cites·19 claims
- 2478US7786594B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·5 cites·25 claims
- 2577US8278766B2Wafer level stack structure for system-in-package and method thereofLEE KANG-WOOK·Filed 2010·Granted Oct 2, 2012·3 cites·16 claims
- 2676US7547977B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 16, 2009·4 cites·14 claims
- 2776US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 2876US6642627B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 4, 2003·14 cites·28 claims
- 2976US5834832APacking structure of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·52 cites·15 claims
- 3076US5428247ADown-bonded lead-on-chip type semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Jun 27, 1995·56 cites·8 claims
- 3175US8587010B2Light emitting device package and method of manufacturing the sameYOO CHEOL JUN·Filed 2011·Granted Nov 19, 2013·3 cites·7 claims
- 3272US8952404B2Light-emitting device package and method of manufacturing the light-emitting device packageYOO CHEOL-JUN·Filed 2012·Granted Feb 10, 2015·3 cites·22 claims
- 3372US8455889B2Lead frame for chip package, chip package, package module, and illumination apparatus including chip package moduleLEE YOUNG-JIN·Filed 2011·Granted Jun 4, 2013·3 cites·61 claims
- 3471US7824959B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·3 cites·13 claims
- 3568US9028082B2Light source module and illumination apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 12, 2015·2 cites·19 claims
- 3668US8894240B2Illumination deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 25, 2014·2 cites·20 claims
- 3768US8115324B2Semiconductor moduleKANG SUN-WON·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 3867US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 3967US6825511B2Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 30, 2004·10 cites·38 claims
- 4064US7732319B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·2 cites·16 claims
- 4163US9099332B2Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 4, 2015·1 cites·20 claims
- 4261US6617700B2Repairable multi-chip package and high-density memory card having the packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 9, 2003·10 cites·14 claims
- 4358US10522522B2Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising sameSONG YOUNG HEE·Filed 2016·Granted Dec 31, 2019·1 cites·3 claims
- 4456US8116088B2Semiconductor package and method of forming the same, and printed circuit boardSHIN MU-SEOB·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims
- 4554US8722435B2Light emitting device package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 13, 2014·0 cites·7 claims
- 4652US7825523B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·0 cites·24 claims
- 4752US2008160682A1Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4852US2014299898A1Light emitting device module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4951US7368330B2Semiconductor device having fuse circuit on cell region and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 6, 2008·3 cites·11 claims
- 5050US7071555B2Ball grid array package stackSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 4, 2006·3 cites·12 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →