Inventor · disambiguated record
Peng Shen
Also filed as: SHEN PENG · Shen Peng Cheng
34 granted patents·11 pending applications·89 citations·filing 2014–2025
95Inventor score
Files withAIR LIQUIDE5VIA ALLIANCE SEMICONDUCTOR CO LTD5AIR LIQUIDE AMERICAN3BEIJING WATERDROP TECH GROUP CO LTD3TAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
45 records- 0195USD986982SMagnetic tile setNINGBO HEYME INFORMATION TECH CO LTD·Filed 2022·Granted May 23, 2023·31 cites·1 claims
- 0290US10529581B2SiN selective etch to SiO2 with non-plasma dry process for 3D NAND device applicationsAIR LIQUIDE·Filed 2017·Granted Jan 7, 2020·9 cites·20 claims
- 0388USD973724SIce makerJIANGSU HAITU INFORMATION TECH CO LTD·Filed 2022·Granted Dec 27, 2022·16 cites·1 claims
- 0488US9966129B1Controller and control method for dynamic random access memoryVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted May 8, 2018·8 cites·20 claims
- 0584US9892932B2Chemistries for TSV/MEMS/power device etchingAIR LIQUIDE AMERICAN·Filed 2015·Granted Feb 13, 2018·3 cites·14 claims
- 0682US12057102B2Language identifying device and computer program for same, and speech processing deviceNAT INST INF & COMM TECH·Filed 2020·Granted Aug 6, 2024·2 cites·10 claims
- 0782US11075084B2Chemistries for etching multi-stacked layersAIR LIQUIDE·Filed 2017·Granted Jul 27, 2021·7 cites·20 claims
- 0881US10103031B2Chemistries for TSV/MEMS/power device etchingAIR LIQUIDE AMERICAN·Filed 2017·Granted Oct 16, 2018·2 cites·18 claims
- 0976US10978520B2Display deviceWUHAN TIANMA MICRO ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·16 claims
- 1076US2025385096A1Wet bench process with in-situ pre-treatment operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1173USD976751SDinosaur statueNINGBO HEYME INFORMATION TECH CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·1 claims
- 1270US11853250B2Interconnect interfaceSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 1370US10216658B2Refreshing of dynamic random access memoryVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 26, 2019·1 cites·14 claims
- 1469US12305710B2Creep free and insulated bearing outer race constructionGM GLOBAL TECH OPERATIONS LLC·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 1567US12347692B2Wet bench process with in-situ pre-treatment operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·19 claims
- 1666US2025155947A1Techniques to modify processor performanceNVIDIA CORP·Filed 2024·Application pending·0 cites
- 1765US10270714B2Switch and data accessing method thereofVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2016·Granted Apr 23, 2019·1 cites·19 claims
- 1865US2025241169A1Display panel and display apparatusHUBEI YANGTZE IND INNOVATION CENTER OF ADVANCED DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 1964US12106940B2Systems and methods for storage and supply of F3NO-free FNO gases and F3NO-free FNO gas mixtures for semiconductor processesAIR LIQUIDE·Filed 2022·Granted Oct 1, 2024·0 cites·4 claims
- 2063US12124308B2Techniques to modify processor performanceNVIDIA CORP·Filed 2022·Granted Oct 22, 2024·0 cites·30 claims
- 2162US12295214B2Display panel including light modulation structure and display device including the display panelHUBEI YANGTZE IND INNOVATION CENTER OF ADVANCED DISPLAY CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 2261US10640845B2High-pressure liquid-state or supercritical-state quenching apparatusSHANGHAI YIBAI IND FURNACES CO LTD·Filed 2017·Granted May 5, 2020·0 cites·10 claims
- 2360US10720335B2Chemistries for TSV/MEMS/power device etchingAIR LIQUIDE AMERICAN·Filed 2018·Granted Jul 21, 2020·0 cites·17 claims
- 2458US12072813B2Method for remapping virtual address to physical address and address remapping unitSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·18 claims
- 2557US11465209B2Binder jetting and supersolidus sintering of ferrous powder metal componentsSTACKPOLE INT POWDER METAL LLC·Filed 2019·Granted Oct 11, 2022·0 cites·35 claims
- 2657US2024357377A1Apparatus, system, and interference avoidance methodHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2756USD1014567SCordless electric 40V brushless snow shovel/throwerSHEN PENG·Filed 2023·Granted Feb 13, 2024·2 cites·1 claims
- 2856US9730331B2Display panel motherboard and manufacturing method thereofBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Aug 8, 2017·0 cites·16 claims
- 2953US10826850B2Switch and data accessing method thereofVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·9 claims
- 3052US2023194736A1System and method for robust seismic imagingCHEVRON USA INC·Filed 2021·Application pending·0 cites
- 3151US12400070B2Method and device for outputting insurance outbound conversation information based on generative large language modelBEIJING WATERDROP TECH GROUP CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·5 claims
- 3249US10655207B2Atmospheric-pressure acetylene carburizing furnaceSHANGHAI YIBAI IND FURNACES CO LTD·Filed 2018·Granted May 19, 2020·0 cites·7 claims
- 3349US2020203127A1Systems and methods for storage and supply of f3no-free fno gases and f3no-free fno gas mixtures for semiconductor processesAIR LIQUIDE·Filed 2018·Application pending·0 cites
- 3449US2023062572A1Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3548US11024513B2Methods for minimizing sidewall damage during low k etch processesLAIR LIQUIDE SA POUR LETUDE ET LEXPLOITATION DES PROCEDES GEORGES CLUADEQ·Filed 2017·Granted Jun 1, 2021·0 cites·8 claims
- 3648US2017110336A1Methods for minimizing sidewall damage during low k etch processesL'AIR LIQUIDE SOCIÉTÉ ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCÉDÉS GEORGES CLUADEQ·Filed 2016·Application pending·0 cites
- 3746US12249322B1Intent recognition method, apparatus and storage mediumBEIJING WATERDROP TECH GROUP CO LTD·Filed 2024·Granted Mar 11, 2025·0 cites·6 claims
- 3846US11088350B2Display device and method for manufacturing the sameWUHAN TIANMA MICRO ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·15 claims
- 3945US2025252123A1Method, apparatus and device for generating a conversation scenario modelBEIJING WATERDROP TECH GROUP CO LTD·Filed 2024·Application pending·0 cites
- 4044US12103290B2Low-temperature dry preparation method for flame-retardant fabric, and flame-retardant mattress coverHEALTHCARE CO LTD·Filed 2020·Granted Oct 1, 2024·0 cites·4 claims
- 4144US11360223B2System and method for improved full waveform inversionCHEVRON USA INC·Filed 2018·Granted Jun 14, 2022·0 cites·4 claims
- 4241US10347498B2Methods of minimizing plasma-induced sidewall damage during low K etch processesAIR LIQUIDE·Filed 2018·Granted Jul 9, 2019·0 cites·9 claims
- 4338US9894001B2I/O circuit and data transmission control methodVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2015·Granted Feb 13, 2018·0 cites·14 claims
- 4435US2020395221A1Method of etching porous filmTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 4531US2020010630A1Porous film sealing method and porous film sealing materialLAIR LIQUIDE SA POUR IETUDE ET IXPOLOITATION DES PROCEDES GEORGES CLAUDE·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →