Inventor · disambiguated record
Brian Matthew Henderson
Also filed as: HENDERSON BRIAN · HENDERSON BRIAN M · HENDERSON BRIAN MATTHEW
23 granted patents·5 pending applications·400 citations·filing 1984–2015
95Inventor score
Top patents by PatentIndex Score
28 records- 0198US8525342B2Dual-side interconnected CMOS for stacked integrated circuitsCHANDRASEKARAN ARVIND·Filed 2010·Granted Sep 3, 2013·248 cites·15 claims
- 0290US8354300B2Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuitsQUALCOMM INC·Filed 2010·Granted Jan 15, 2013·13 cites·28 claims
- 0389US8143952B2Three dimensional inductor and transformerKIM JONGHAE·Filed 2009·Granted Mar 27, 2012·14 cites·23 claims
- 0488US8362599B2Forming radio frequency integrated circuitsQUALCOMM INC·Filed 2009·Granted Jan 29, 2013·26 cites·30 claims
- 0587US8350358B2Techniques for placement of active and passive devices within a chipQUALCOMM INC·Filed 2011·Granted Jan 8, 2013·7 cites·18 claims
- 0686US8557680B2Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafersCHANDRASEKARAN ARVIND·Filed 2012·Granted Oct 15, 2013·7 cites·20 claims
- 0786US8242543B2Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafersCHANDRASEKARAN ARVIND·Filed 2009·Granted Aug 14, 2012·12 cites·9 claims
- 0884US8536893B2Circuit for measuring magnitude of electrostatic discharge (ESD) events for semiconductor chip bondingWORLEY EUGENE R·Filed 2009·Granted Sep 17, 2013·12 cites·23 claims
- 0983US8067816B2Techniques for placement of active and passive devices within a chipKIM JONGHAE·Filed 2009·Granted Nov 29, 2011·7 cites·13 claims
- 1082US9184130B2Electrostatic protection for stacked multi-chip integrated circuitsQUALCOMM INC·Filed 2012·Granted Nov 10, 2015·6 cites·30 claims
- 1181US9153461B2Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor deviceQUALCOMM INC·Filed 2014·Granted Oct 6, 2015·4 cites·30 claims
- 1278US8508301B2Three dimensional inductor, transformer and radio frequency amplifierKIM JONGHAE·Filed 2011·Granted Aug 13, 2013·3 cites·22 claims
- 1377US9041220B2Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor deviceQUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·16 claims
- 1477US8324066B2Techniques for placement of active and passive devices within a chipKIM JONGHAE·Filed 2011·Granted Dec 4, 2012·3 cites·16 claims
- 1567US9190201B2Magnetic film enhanced inductorLI XIA·Filed 2009·Granted Nov 17, 2015·3 cites·25 claims
- 1667US4647850AIntegrated circuit for measuring mask misalignmentBURROUGHS CORP·Filed 1984·Granted Mar 3, 1987·20 cites·12 claims
- 1766US9379201B2Electrostatic discharge diodes and methods of forming electrostatic discharge diodesQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·1 cites·16 claims
- 1866US8319325B2Intra-die routing using back side redistribution layer and associated methodHENDERSON BRIAN M·Filed 2009·Granted Nov 27, 2012·6 cites·33 claims
- 1964US9093462B2Electrostatic discharge diodeQUALCOMM INC·Filed 2013·Granted Jul 28, 2015·1 cites·13 claims
- 2064US8912043B2Dual-side interconnected CMOS for stacked integrated circuitsQUALCOMM INC·Filed 2013·Granted Dec 16, 2014·1 cites·20 claims
- 2160US8198736B2Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assemblyHENDERSON BRIAN M·Filed 2009·Granted Jun 12, 2012·2 cites·13 claims
- 2250US8618539B2Interconnect sensor for detecting delaminationHENDERSON BRIAN MATTHEW·Filed 2009·Granted Dec 31, 2013·1 cites·18 claims
- 2350US2014225246A1Dual substrate, power distribution and thermal solution for direct stacked integrated devicesQUALCOMM INC·Filed 2013·Application pending·0 cites
- 2450US2014225248A1Power distribution and thermal solution for direct stacked integrated circuitsQUALCOMM INC·Filed 2013·Application pending·0 cites
- 2547US8604626B2Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assemblyHENDERSON BRIAN M·Filed 2012·Granted Dec 10, 2013·0 cites·8 claims
- 2643US2015048497A1Interposer with electrostatic discharge protectionQUALCOMM INC·Filed 2013·Application pending·0 cites
- 2742US2014306349A1Low cost interposer comprising an oxidation layerQUALCOMM INC·Filed 2013·Application pending·0 cites
- 2839US2014266286A1Through-substrate via with a fuse structureQUALCOMM INC·Filed 2013·Application pending·0 cites
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