Inventor · disambiguated record
Kai Yun Yow
Also filed as: YOW KAI YUN
14 granted patents·9 pending applications·50 citations·filing 2008–2016
89Inventor score
Top patents by PatentIndex Score
23 records- 0192US8501517B1Method of assembling pressure sensor deviceYOW KAI YUN·Filed 2012·Granted Aug 6, 2013·21 cites·17 claims
- 0279US9165855B1Semiconductor device with die attached heat spreaderYOW KAI YUN·Filed 2014·Granted Oct 20, 2015·5 cites·7 claims
- 0379US9030000B2Mold cap for semiconductor deviceEU POH LENG·Filed 2013·Granted May 12, 2015·6 cites·8 claims
- 0470US8836091B1Lead frame for semiconductor package with enhanced stress reliefYOW KAI YUN·Filed 2013·Granted Sep 16, 2014·3 cites·18 claims
- 0570US8643169B2Semiconductor sensor device with over-molded lidYOW KAI YUN·Filed 2011·Granted Feb 4, 2014·3 cites·6 claims
- 0666US8415779B2Lead frame for semiconductor packageWONG TZU LING·Filed 2011·Granted Apr 9, 2013·3 cites·18 claims
- 0764US8078353B2Self monitoring braking system for vehiclesYOW KAI YUN·Filed 2009·Granted Dec 13, 2011·3 cites·20 claims
- 0861US9997445B2Substrate interconnections for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Jun 12, 2018·1 cites·8 claims
- 0961US7868449B2Semiconductor substrate and method of connecting semiconductor die to substrateFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 11, 2011·2 cites·14 claims
- 1060US9437492B2Substrate for alternative semiconductor die configurationsYOW KAI YUN·Filed 2014·Granted Sep 6, 2016·1 cites·8 claims
- 1159US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 1257US7759753B2Integrated circuit die, integrated circuit package, and packaging methodFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 20, 2010·1 cites·8 claims
- 1350US2010059883A1Method of forming ball bondFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1446US2015183131A1Semiconductor wafer dicing bladeFOONG CHEE SENG·Filed 2013·Application pending·0 cites
- 1546US2011084375A1Semiconductor device package with integrated stand-offFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1646US2011062569A1Semiconductor device package with down-set leadsFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1745US2011012257A1Heat spreader for semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 1844US2011068469A1Semiconductor package with pre-formed ball bondsFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 1942US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 2041US2015014793A1Pressure sensor having down-set flagYOW KAI YUN·Filed 2013·Application pending·0 cites
- 2138US9646853B1IC device having patterned, non-conductive substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 9, 2017·0 cites·10 claims
- 2236US2012074549A1Semiconductor device with exposed padYOW KAI YUN·Filed 2010·Application pending·0 cites
- 2334US9698093B2Universal BGA substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jul 4, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →