Inventor · disambiguated record
Frank Puschner
Also filed as: PUESCHNER FRANK · PUSCHNER FRANK · PÜSCHNER FRANK
20 granted patents·11 pending applications·157 citations·filing 1997–2024
94Inventor score
Top patents by PatentIndex Score
31 records- 0189US7605453B2Chip module and chip cardINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 20, 2009·26 cites·36 claims
- 0282US7240847B2Chip cardCIRCLE SMART CARD AG·Filed 2005·Granted Jul 10, 2007·22 cites·7 claims
- 0374US2024298714A1Electronic inhalation apparatus with a chip module fixed with a folding structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0471US7069652B2Method for producing laminated smart cardsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 4, 2006·15 cites·5 claims
- 0569US7633149B2Integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 15, 2009·4 cites·21 claims
- 0667US7337967B2Chip card moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 4, 2008·4 cites·13 claims
- 0765US7579679B2Chipcard with contact areas and method for producing contact areasINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 25, 2009·3 cites·7 claims
- 0864US12499343B2Wafer-level package sensor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 0963US7451936B2Module for contactless chip cards or identification systemsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 18, 2008·2 cites·21 claims
- 1060US9324642B2Method of electrically isolating shared leads of a lead frame stripINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 26, 2016·2 cites·20 claims
- 1160US6472250B1Method for producing a chip moduleINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 29, 2002·10 cites·6 claims
- 1260US6375083B2Smart cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 23, 2002·25 cites·8 claims
- 1357US6719205B1Carrier element for a semiconductor chip for incorporation into smart cardsINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 13, 2004·17 cites·13 claims
- 1455US2023361076A1Chip arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1555US2025045555A1Method for producing a smart card inlay, smart card inlay and smart cardINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1654US7100836B2Module for contactless chip cards or identification systemsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 5, 2006·4 cites·5 claims
- 1754US2024078406A1Chip assembly, method for forming a chip assembly, and method for using a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1853US2023298989A1Chip-interconnect arrangement, method for forming a chip-interconnect arrangement, document structure and method for forming a document structureINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1952US6778407B2Portable data carrierINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 17, 2004·7 cites·8 claims
- 2051US6557769B2Smart card module, smart card with the smart card module, and method for producing the smart card moduleINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 6, 2003·3 cites·17 claims
- 2147USD406821SCarrier element for a semiconductor chip for integration into a chipcard, or a chipcard moduleSIEMENS AG·Filed 1997·Granted Mar 16, 1999·6 cites·1 claims
- 2246US2023289554A1Smart card module, smart card module arrangement and smart cardINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2344US7159786B2Data carrier cardINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 9, 2007·0 cites·20 claims
- 2443US2006043200A1Chip card moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2542US2006043575A1Chip moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2642US2005272249A1Method and system for producing conductive patterns on a substrateINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2741US6992898B2Smart-card module with an anisotropically conductive substrate filmINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 31, 2006·0 cites·7 claims
- 2840US7397140B2Chip moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 8, 2008·0 cites·17 claims
- 2939US2005239237A1Method for producing a BGA chip module and BGA chip moduleINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 3037US6469902B1Adhesive joint assemblySIEMENS AG·Filed 1999·Granted Oct 22, 2002·7 cites·6 claims
- 3137US2004256150A1Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formedINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →