Inventor · disambiguated record
Steven B. Herschbein
Also filed as: HERSCHBEIN STEVEN B · HERSCHBEIN STEVEN BRETT
12 granted patents·7 pending applications·115 citations·filing 2001–2013
90Inventor score
Top patents by PatentIndex Score
19 records- 0188US7119333B2Ion detector for ion beam applicationsIBM·Filed 2004·Granted Oct 10, 2006·34 cites·20 claims
- 0287US7351966B1High-resolution optical channel for non-destructive navigation and processing of integrated circuitsIBM·Filed 2006·Granted Apr 1, 2008·11 cites·20 claims
- 0375US6730237B2Focused ion beam process for removal of copperIBM·Filed 2001·Granted May 4, 2004·21 cites·11 claims
- 0471US6670717B2Structure and method for charge sensitive electrical devicesIBM·Filed 2001·Granted Dec 30, 2003·13 cites·21 claims
- 0570US6858530B2Method for electrically characterizing charge sensitive semiconductor devicesIBM·Filed 2003·Granted Feb 22, 2005·12 cites·10 claims
- 0668US7781733B2In-situ high-resolution light-optical channel for optical viewing and surface processing in parallel with charged particle (FIB and SEM) techniquesIBM·Filed 2007·Granted Aug 24, 2010·2 cites·20 claims
- 0762US6900137B2Dry etch process to edit copper linesIBM·Filed 2003·Granted May 31, 2005·10 cites·20 claims
- 0857US6987067B2Semiconductor copper line cutting methodIBM·Filed 2002·Granted Jan 17, 2006·7 cites·20 claims
- 0956US6946064B2Sample mount for performing sputter-deposition in a focused ion beam (FIB) toolIBM·Filed 2003·Granted Sep 20, 2005·3 cites·14 claims
- 1050US8111903B2Inline low-damage automated failure analysisHERSCHBEIN STEVEN B·Filed 2008·Granted Feb 7, 2012·2 cites·15 claims
- 1146US2014073114A1In-situ active wafer charge screening by conformal groundingGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 1243US7867910B2Method of accessing semiconductor circuits from the backside using ion-beam and gas-etchIBM·Filed 2008·Granted Jan 11, 2011·0 cites·15 claims
- 1341US6843893B2Metal dry etch using electronic fieldIBM·Filed 2002·Granted Jan 18, 2005·0 cites·13 claims
- 1440US2013200501A1In-situ active wafer charge screening by conformal groundingCEN CHENG·Filed 2012·Application pending·0 cites
- 1538US2005016954A1System and methods of altering a very small surface areaIBM·Filed 2003·Application pending·0 cites
- 1638US2004060904A1Tool having a plurality of electrodes and corresponding method of altering a very small surfaceIBM·Filed 2002·Application pending·0 cites
- 1738US2005016952A1System and method of altering a very small surface area by multiple channel probeIBM·Filed 2003·Application pending·0 cites
- 1835US2006065853A1Apparatus and method for manipulating sample temperature for focused ion beam processingRUE CHAD·Filed 2004·Application pending·0 cites
- 1934US2004132287A1Dry etch process for copperIBM·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →