Inventor · disambiguated record
Piyush Savalia
Also filed as: SAVALIA PIYUSH
59 granted patents·19 pending applications·498 citations·filing 2009–2021
98Inventor score
Top patents by PatentIndex Score
78 records- 0198US8847376B2Microelectronic elements with post-assembly planarizationOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·49 cites·28 claims
- 0298US8841765B2Multi-chip module with stacked face-down connected diesHABA BELGACEM·Filed 2011·Granted Sep 23, 2014·64 cites·26 claims
- 0398US8791575B2Microelectronic elements having metallic pads overlying viasOGANESIAN VAGE·Filed 2010·Granted Jul 29, 2014·87 cites·29 claims
- 0498US8598695B2Active chip on carrier or laminated chip having microelectronic element embedded thereinOGANESIAN VAGE·Filed 2010·Granted Dec 3, 2013·39 cites·29 claims
- 0597US8796135B2Microelectronic elements with rear contacts connected with via first or via middle structuresOGANESIAN VAGE·Filed 2010·Granted Aug 5, 2014·45 cites·24 claims
- 0695US8736066B2Stacked microelectronic assemby with TSVS formed in stages and carrier above chipOGANESIAN VAGE·Filed 2011·Granted May 27, 2014·17 cites·24 claims
- 0794US8742541B2High density three-dimensional integrated capacitorsMOHAMMED ILYAS·Filed 2011·Granted Jun 3, 2014·16 cites·36 claims
- 0894US8610259B2Multi-function and shielded 3D interconnectsOGANESIAN VAGE·Filed 2010·Granted Dec 17, 2013·15 cites·36 claims
- 0994US8502340B2High density three-dimensional integrated capacitorsOGANESIAN VAGE·Filed 2010·Granted Aug 6, 2013·15 cites·19 claims
- 1093US8486758B2Simultaneous wafer bonding and interconnect joiningOGANESIAN VAGE·Filed 2011·Granted Jul 16, 2013·14 cites·48 claims
- 1191US10157978B2High density three-dimensional integrated capacitorsTESSERA INC·Filed 2016·Granted Dec 18, 2018·5 cites·11 claims
- 1291US8847380B2Staged via formation from both sides of chipOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·10 cites·25 claims
- 1391US8637968B2Stacked microelectronic assembly having interposer connecting active chipsHABA BELGACEM·Filed 2010·Granted Jan 28, 2014·14 cites·33 claims
- 1490US9431475B2High density three-dimensional integrated capacitorsTESSERA INC·Filed 2013·Granted Aug 30, 2016·7 cites·17 claims
- 1589US9437557B2High density three-dimensional integrated capacitorsTESSERA INC·Filed 2015·Granted Sep 6, 2016·5 cites·20 claims
- 1687US9355948B2Multi-function and shielded 3D interconnectsTESSERA INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 1787US9269692B2Stacked microelectronic assembly with TSVS formed in stages and carrier above chipTESSERA INC·Filed 2014·Granted Feb 23, 2016·5 cites·22 claims
- 1887US8709913B2Simultaneous wafer bonding and interconnect joiningTESSERA INC·Filed 2013·Granted Apr 29, 2014·7 cites·20 claims
- 1986US10354942B2Staged via formation from both sides of chipTESSERA INC·Filed 2017·Granted Jul 16, 2019·3 cites·19 claims
- 2085US9125333B2Electrical barrier layersUZOH CYPRIAN·Filed 2011·Granted Sep 1, 2015·6 cites·29 claims
- 2183US9099479B2Carrier structures for microelectronic elementsOGANESIAN VAGE·Filed 2012·Granted Aug 4, 2015·4 cites·25 claims
- 2283US8937361B2BSI image sensor package with variable-height silicon for even reception of different wavelengthsOGANESIAN VAGE·Filed 2011·Granted Jan 20, 2015·3 cites·36 claims
- 2383US8697569B2Non-lithographic formation of three-dimensional conductive elementsOGANESIAN VAGE·Filed 2010·Granted Apr 15, 2014·5 cites·63 claims
- 2483US8685793B2Chip assembly having via interconnects joined by platingOGANESIAN VAGE·Filed 2010·Granted Apr 1, 2014·6 cites·32 claims
- 2583US8610264B2Compliant interconnects in wafersOGANESIAN VAGE·Filed 2010·Granted Dec 17, 2013·5 cites·25 claims
- 2682US8956916B2Multi-chip module with stacked face-down connected diesTESSERA INC·Filed 2014·Granted Feb 17, 2015·4 cites·20 claims
- 2781US9620437B2Stacked microelectronic assembly with TSVS formed in stages and carrier above chipTESSERA INC·Filed 2016·Granted Apr 11, 2017·2 cites·20 claims
- 2880US9455181B2Vias in porous substratesTESSERA INC·Filed 2015·Granted Sep 27, 2016·3 cites·22 claims
- 2980US8587126B2Stacked microelectronic assembly with TSVs formed in stages with plural active chipsOGANESIAN VAGE·Filed 2011·Granted Nov 19, 2013·4 cites·11 claims
- 3079US9859220B2Laminated chip having microelectronic element embedded thereinTESSERA INC·Filed 2016·Granted Jan 2, 2018·2 cites·13 claims
- 3179US9847277B2Staged via formation from both sides of chipTESSERA INC·Filed 2016·Granted Dec 19, 2017·2 cites·5 claims
- 3278US9560773B2Electrical barrier layersTESSERA INC·Filed 2015·Granted Jan 31, 2017·2 cites·2 claims
- 3378US9190463B2High density three-dimensional integrated capacitorsTESSERA INC·Filed 2014·Granted Nov 17, 2015·3 cites·20 claims
- 3476US11004930B2High density three-dimensional integrated capacitorsTESSERA INC·Filed 2018·Granted May 11, 2021·1 cites·10 claims
- 3575US9041133B2BSI image sensor package with embedded absorber for even reception of different wavelengthsOGANESIAN VAGE·Filed 2011·Granted May 26, 2015·4 cites·29 claims
- 3674US10262947B2Active chip on carrier or laminated chip having microelectronic element embedded thereinTESSERA INC·Filed 2017·Granted Apr 16, 2019·1 cites·20 claims
- 3774US9966303B2Microelectronic elements with post-assembly planarizationTESSERA INC·Filed 2017·Granted May 8, 2018·1 cites·20 claims
- 3874US9362203B2Staged via formation from both sides of chipTESSERA INC·Filed 2014·Granted Jun 7, 2016·2 cites·9 claims
- 3973US9018769B2Non-lithographic formation of three-dimensional conductive elementsTESSERA INC·Filed 2014·Granted Apr 28, 2015·2 cites·20 claims
- 4073US2021265460A1High Density Three-dimensional Integrated CapacitorsTESSERA INC·Filed 2021·Application pending·0 cites
- 4172US9099296B2Stacked microelectronic assembly with TSVS formed in stages with plural active chipsTESSERA INC·Filed 2013·Granted Aug 4, 2015·2 cites·10 claims
- 4269US8975751B2Vias in porous substratesMOHAMMED ILYAS·Filed 2011·Granted Mar 10, 2015·2 cites·40 claims
- 4369US8411435B2Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrodeJEWELL-LARSEN NELS·Filed 2009·Granted Apr 2, 2013·4 cites·20 claims
- 4466US8512491B2Dual wafer spin coatingOGANESIAN VAGE·Filed 2010·Granted Aug 20, 2013·1 cites·32 claims
- 4565US8796828B2Compliant interconnects in wafersTESSERA INC·Filed 2013·Granted Aug 5, 2014·1 cites·12 claims
- 4662US8841763B2Three-dimensional system-in-a-packageOGANESIAN VAGE·Filed 2011·Granted Sep 23, 2014·1 cites·5 claims
- 4761US10559494B2Microelectronic elements with post-assembly planarizationTESSERA INC·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 4857US9355959B2Active chip on carrier or laminated chip having microelectronic element embedded thereinTESSERA INC·Filed 2013·Granted May 31, 2016·0 cites·13 claims
- 4957US9224649B2Compliant interconnects in wafersTESSERA INC·Filed 2014·Granted Dec 29, 2015·0 cites·19 claims
- 5056US8809190B2Multi-function and shielded 3D interconnectsTESSERA INC·Filed 2013·Granted Aug 19, 2014·0 cites·14 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →