Inventor · disambiguated record
Hope Chiu
Also filed as: CHIU HOPE
11 granted patents·3 pending applications·6 citations·filing 2020–2023
80Inventor score
Top patents by PatentIndex Score
14 records- 0189US11837476B2Flip-chip package with reduced underfill areaWESTERN DIGITAL TECH INC·Filed 2020·Granted Dec 5, 2023·3 cites·9 claims
- 0288US11942459B2Semiconductor device package with exposed bond wiresWESTERN DIGITAL TECH INC·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
- 0381US11508644B2Semiconductor device package having thermally conductive pathwaysWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 22, 2022·1 cites·19 claims
- 0456US2024304515A1High thermal dissipation features for a flip chip structureWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0552US12062625B2Semiconductor device package mold flow control system and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 0652US11810896B2Substrate component layout and bonding method for increased package capacityWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 0750US11488883B1Semiconductor device package having thermally conductive layers for heat dissipationWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 0848US12482761B2Semiconductor device package having improved conductive stub coverageSANDISK TECHNOLOGIES INC·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 0948US12027497B2Semiconductor device with unbalanced die stackupWESTERN DIGITAL TECH INC·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1047US12347810B2Semiconductor device package die stacking system and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 1, 2025·0 cites·13 claims
- 1146US12021060B2Reducing keep-out-zone area for a semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2020·Granted Jun 25, 2024·0 cites·18 claims
- 1245US2023299034A1Semiconductor Device With Optimized Underfill FlowWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1344US2023411179A1Laser Cutting With Electron RemovalWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1443US12021061B2Packaged memory device with flip chip and wire bond diesWESTERN DIGITAL TECH INC·Filed 2021·Granted Jun 25, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →