Inventor · disambiguated record
Zengyu Zhou
Also filed as: ZHOU ZENGYU
8 granted patents·5 pending applications·10 citations·filing 2017–2024
76Inventor score
Files withWESTERN DIGITAL TECH INC9SANDISK INFORMATION TECH SHANGHAI CO LTD2SANDISK TECHNOLOGIES INC2
Top patents by PatentIndex Score
13 records- 0188US10177119B2Fan out semiconductor device including a plurality of semiconductor dieSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jan 8, 2019·6 cites·20 claims
- 0277US10236276B2Semiconductor device including vertically integrated groups of semiconductor packagesSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 19, 2019·4 cites·17 claims
- 0356US2024304515A1High thermal dissipation features for a flip chip structureWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0455US2025385152A1Semiconductor device including an integrated wafer level heat sink window plateSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0555US2025391732A1Semiconductor device including an integrated tim-on-dieSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0654US11031378B2Semiconductor device including high speed heterogeneous integrated controller and cacheWESTERN DIGITAL TECH INC·Filed 2020·Granted Jun 8, 2021·0 cites·20 claims
- 0753US11917761B2Tombstone prevention for a surface mount deviceWESTERN DIGITAL TECH INC·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 0853US11784135B2Semiconductor device including conductive bumps to improve EMI/RFI shieldingWESTERN DIGITAL TECH INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 0952US11810896B2Substrate component layout and bonding method for increased package capacityWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1049US2024332156A1Substrate having an increased metal trace thicknessWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1146US12021060B2Reducing keep-out-zone area for a semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2020·Granted Jun 25, 2024·0 cites·18 claims
- 1245US2023299034A1Semiconductor Device With Optimized Underfill FlowWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1343US12021061B2Packaged memory device with flip chip and wire bond diesWESTERN DIGITAL TECH INC·Filed 2021·Granted Jun 25, 2024·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Zengyu Zhou files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →