Inventor · disambiguated record
Rihoko Watanabe
Also filed as: WATANABE RIHOKO
5 granted patents·5 pending applications·0 citations·filing 2017–2021
58Inventor score
Files withPANASONIC IP MAN CO LTD10
Top patents by PatentIndex Score
10 records- 0161US2023331957A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0260US11945910B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·12 claims
- 0359US2023323104A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0459US2023331944A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0558US12122129B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·12 claims
- 0655US2023250282A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0753US2023257581A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0850US11407869B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 9, 2022·0 cites·9 claims
- 0948US12275846B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·13 claims
- 1046US11234329B2Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 25, 2022·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →