Inventor · disambiguated record
Doo Soub Shin
Also filed as: SHIN DOO SOUB
7 granted patents·1 pending application·10 citations·filing 2017–2024
77Inventor score
Top patents by PatentIndex Score
8 records- 0193US10553542B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 4, 2020·9 cites·20 claims
- 0285US12243834B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0380US11967567B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 0480US11075170B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 27, 2021·1 cites·21 claims
- 0573US11637073B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 0673US2024047852A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0770US11742565B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0861US11101540B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →