Inventor · disambiguated record
Andy Tsen
Also filed as: TSEN ANDY
12 granted patents·139 citations·filing 2009–2011
91Inventor score
Top patents by PatentIndex Score
12 records- 0193US8437870B2System and method for implementing a virtual metrology advanced process control platformTSAI PO-FENG·Filed 2009·Granted May 7, 2013·31 cites·17 claims
- 0292US8229588B2Method and system for tuning advanced process control parametersTSEN ANDY·Filed 2009·Granted Jul 24, 2012·32 cites·17 claims
- 0392US8108060B2System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architectureTSEN ANDY·Filed 2009·Granted Jan 31, 2012·25 cites·19 claims
- 0484US8394719B2System and method for implementing multi-resolution advanced process controlTSEN ANDY·Filed 2011·Granted Mar 12, 2013·9 cites·20 claims
- 0584US8224475B2Method and apparatus for advanced process controlTSAI PO-FENG·Filed 2009·Granted Jul 17, 2012·10 cites·20 claims
- 0682US8396583B2Method and system for implementing virtual metrology in semiconductor fabricationTSAI PO-FENG·Filed 2010·Granted Mar 12, 2013·6 cites·20 claims
- 0781US8041451B2Method for bin-based controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 18, 2011·9 cites·21 claims
- 0880US8082055B2Method for a bin ratio forecast at new tape out stageLIN CHUN-HSIEN·Filed 2009·Granted Dec 20, 2011·7 cites·20 claims
- 0967US8239056B2Advanced process control for new tapeout productHSU CHIH-WEI·Filed 2009·Granted Aug 7, 2012·2 cites·20 claims
- 1066US7951615B2System and method for implementing multi-resolution advanced process controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 31, 2011·2 cites·20 claims
- 1165US8392009B2Advanced process control with novel sampling policyFEI WANG JO·Filed 2009·Granted Mar 5, 2013·4 cites·19 claims
- 1264US8219341B2System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) with routing modelTSEN ANDY·Filed 2009·Granted Jul 10, 2012·2 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →