Inventor · disambiguated record
Wayne Joon Yong Tan
Also filed as: TAN WAYNE · TAN WAYNE JOON YONG
9 granted patents·3 pending applications·55 citations·filing 1998–2015
86Inventor score
Top patents by PatentIndex Score
12 records- 0181US8504772B2Method and apparatus for wireless digital content managementTAN WAYNE JOON YONG·Filed 2008·Granted Aug 6, 2013·7 cites·22 claims
- 0280US9152907B2Method and memory card for wireless digital content managementTAN WAYNE JOON YONG·Filed 2009·Granted Oct 6, 2015·7 cites·15 claims
- 0349US6140168AMethod of fabricating self-aligned contact windowUNITED MICROELECTRONICS CORP·Filed 1999·Granted Oct 31, 2000·15 cites·12 claims
- 0444US6200904B1Method of forming a contact hole of a DRAMUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 13, 2001·12 cites·8 claims
- 0544US2011072503A1Method of authentication for a wireless enabled memory cardTAN WAYNE JOON YONG·Filed 2009·Application pending·0 cites
- 0638US9569807B2Memory card for providing menu items to a remote wireless-enabled apparatusTAN WAYNE JOON YONG·Filed 2010·Granted Feb 14, 2017·0 cites·25 claims
- 0738US2014351543A1Method for Restricting Access to Data Stored on a Memory Card and a Memory CardTAN WAYNE JOON YONG·Filed 2011·Application pending·0 cites
- 0837US6136642AMethod of making a dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 24, 2000·4 cites·22 claims
- 0934US6150278AMethod of fabricating node capacitor for DRAM processesUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 21, 2000·4 cites·26 claims
- 1033US6331471B1Method for improving peeling issues during fabrication of integrated circuitsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Dec 18, 2001·4 cites·12 claims
- 1132US6218243B1Method of fabricating a DRAM capacitorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 17, 2001·2 cites·16 claims
- 1232US2017048687A1System and method for detecting a handshakeTREK TECH (SINGAPORE) PTE LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →