Inventor · disambiguated record
Youji Katayama
Also filed as: KATAYAMA YOUJI
3 granted patents·2 pending applications·0 citations·filing 2007–2012
41Inventor score
Top patents by PatentIndex Score
5 records- 0149US8759440B2Heat-resistant resin pasteKAWAKAMI HIROYUKI·Filed 2007·Granted Jun 24, 2014·0 cites·13 claims
- 0247US8232185B2Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the filmNAKAMURA YUUKI·Filed 2008·Granted Jul 31, 2012·0 cites·7 claims
- 0342US2012244347A1Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the filmNAKAMURA YUUKI·Filed 2012·Application pending·0 cites
- 0440US8404564B2Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using themNAKAMURA YUUKI·Filed 2008·Granted Mar 26, 2013·0 cites·7 claims
- 0538US2011210407A1Double-faced adhesive film and electronic component module using sameKATAYAMA YOUJI·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Youji Katayama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →