Inventor · disambiguated record

Ey Yong Kim

Also filed as: KIM EY YONG

2 granted patents·9 citations·filing 2010–2013

51Inventor score

Technology areasH10W

Files withKIM EY YONG1 SAMSUNG ELECTRO MECH1

Top patents by PatentIndex Score

2 records

0181US8558360B2Flip chip package and method of manufacturing the sameKIM EY YONG·Filed 2010·Granted Oct 15, 2013·9 cites·15 claims
0251US8809122B2Method of manufacturing flip chip packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 19, 2014·0 cites·15 claims

Join the waitlist — get patent alerts

Get an alert when Ey Yong Kim files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →