Inventor · disambiguated record
Tiruchirapalli Arunagiri
Also filed as: ARUNAGIRI TIRUCHIRAPALLI · ARUNAGIRI TIRUCHIRAPALLI N
17 granted patents·8 pending applications·85 citations·filing 2006–2015
92Inventor score
Top patents by PatentIndex Score
25 records- 0191US8241701B2Processes and systems for engineering a barrier surface for copper depositionDORDI YEZDI·Filed 2006·Granted Aug 14, 2012·16 cites·28 claims
- 0290US8771804B2Processes and systems for engineering a copper surface for selective metal depositionDORDI YEZDI·Filed 2006·Granted Jul 8, 2014·16 cites·27 claims
- 0390US8404626B2Post-deposition cleaning methods and formulations for substrates with cap layersKOLICS ARTUR·Filed 2008·Granted Mar 26, 2013·14 cites·22 claims
- 0485US8026605B2Interconnect structure and method of manufacturing a damascene structureLAM RES CORP·Filed 2006·Granted Sep 27, 2011·8 cites·18 claims
- 0583US8747960B2Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicideDORDI YEZDI·Filed 2006·Granted Jun 10, 2014·11 cites·20 claims
- 0676US8133812B2Methods and systems for barrier layer surface passivationDORDI YEZDI·Filed 2009·Granted Mar 13, 2012·4 cites·12 claims
- 0776US7592259B2Methods and systems for barrier layer surface passivationLAM RES CORP·Filed 2006·Granted Sep 22, 2009·4 cites·24 claims
- 0875US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 0969US7709400B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2007·Granted May 4, 2010·2 cites·25 claims
- 1068US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 1166US8790465B2Post-deposition cleaning methods for substrates with cap layersLAM RES CORP·Filed 2013·Granted Jul 29, 2014·1 cites·23 claims
- 1264US2010062164A1Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating ProcessLAM RES·Filed 2008·Application pending·0 cites
- 1361US8551575B1Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating processLI SHIJIAN·Filed 2012·Granted Oct 8, 2013·0 cites·23 claims
- 1461US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 1557US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 1654US2014322446A1Processes and systems for engineering a copper surface for selective metal depositionLAM RES CORP·Filed 2014·Application pending·0 cites
- 1752US9287110B2Method and apparatus for wafer electroless platingLAM RES CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 1851US2012269987A1Processes and Systems for Engineering a Barrier Surface for Copper DepositionDORDI YEZDI·Filed 2012·Application pending·0 cites
- 1950US2015214093A1Processes and systems for engineering a barrier surface for copper depositionLAM RES CORP·Filed 2015·Application pending·0 cites
- 2049US7884017B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2010·Granted Feb 8, 2011·0 cites·3 claims
- 2148US2011306203A1Interconnect structure and method of manufacturing a damascene structureDORDI YEZDI·Filed 2011·Application pending·0 cites
- 2244US2009304914A1Self assembled monolayer for improving adhesion between copper and barrier layerLAM RES CORP·Filed 2006·Application pending·0 cites
- 2344US2008152823A1Self-limiting plating methodLAM RES CORP·Filed 2006·Application pending·0 cites
- 2443US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
- 2543US2008057182A1Method for gap fill in controlled ambient systemBOYD JOHN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →