Inventor · disambiguated record
William Thie
Also filed as: THIE WILLIAM
33 granted patents·12 pending applications·202 citations·filing 2003–2021
97Inventor score
Top patents by PatentIndex Score
45 records- 0192US7829152B2Electroless plating method and apparatusLAM RES CORP·Filed 2006·Granted Nov 9, 2010·18 cites·8 claims
- 0292US7297190B1Plating solutions for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Nov 20, 2007·36 cites·25 claims
- 0391US8241701B2Processes and systems for engineering a barrier surface for copper depositionDORDI YEZDI·Filed 2006·Granted Aug 14, 2012·16 cites·28 claims
- 0490US8883027B2Methods for removing a metal oxide from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Nov 11, 2014·10 cites·30 claims
- 0590US8771804B2Processes and systems for engineering a copper surface for selective metal depositionDORDI YEZDI·Filed 2006·Granted Jul 8, 2014·16 cites·27 claims
- 0690US8622020B2Simultaneous electroless plating of two substratesTHIE WILLIAM·Filed 2010·Granted Jan 7, 2014·10 cites·17 claims
- 0790US8404626B2Post-deposition cleaning methods and formulations for substrates with cap layersKOLICS ARTUR·Filed 2008·Granted Mar 26, 2013·14 cites·22 claims
- 0885US8026605B2Interconnect structure and method of manufacturing a damascene structureLAM RES CORP·Filed 2006·Granted Sep 27, 2011·8 cites·18 claims
- 0984US7662253B2Apparatus for the removal of a metal oxide from a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Feb 16, 2010·8 cites·20 claims
- 1083US8747960B2Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicideDORDI YEZDI·Filed 2006·Granted Jun 10, 2014·11 cites·20 claims
- 1177US7752996B2Apparatus for applying a plating solution for electroless depositionLAM RES CORP·Filed 2006·Granted Jul 13, 2010·4 cites·9 claims
- 1276US8133812B2Methods and systems for barrier layer surface passivationDORDI YEZDI·Filed 2009·Granted Mar 13, 2012·4 cites·12 claims
- 1376US7592259B2Methods and systems for barrier layer surface passivationLAM RES CORP·Filed 2006·Granted Sep 22, 2009·4 cites·24 claims
- 1475US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 1575US8691698B2Controlled gas mixing for smooth sidewall rapid alternating etch processXU QING·Filed 2012·Granted Apr 8, 2014·3 cites·19 claims
- 1674US8603913B1Porous dielectrics K value restoration by thermal treatment and or solvent treatmentLAM RES CORP·Filed 2012·Granted Dec 10, 2013·3 cites·18 claims
- 1769US7709400B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2007·Granted May 4, 2010·2 cites·25 claims
- 1869US7040332B2Method and apparatus for megasonic cleaning with reflected acoustic wavesLAM RES CORP·Filed 2003·Granted May 9, 2006·12 cites·14 claims
- 1969US6995067B2Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiencyLAM RES CORP·Filed 2003·Granted Feb 7, 2006·10 cites·10 claims
- 2068US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 2166US8790465B2Post-deposition cleaning methods for substrates with cap layersLAM RES CORP·Filed 2013·Granted Jul 29, 2014·1 cites·23 claims
- 2266US8490573B2Method and apparatus for material depositionDORDI YEZDI·Filed 2010·Granted Jul 23, 2013·1 cites·10 claims
- 2363US7875554B2Method for electroless depositing a material on a surface of a waferLAM RES CORP·Filed 2008·Granted Jan 25, 2011·1 cites·21 claims
- 2462US2007048447A1System and method for forming patterned copper lines through electroless copper platingLEE ALAN·Filed 2006·Application pending·0 cites
- 2561US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 2660US2015034589A1System and method for forming patterned copper lines through electroless copper platingLAM RES CORP·Filed 2014·Application pending·0 cites
- 2757US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 2855US7582565B2Method and apparatus for semiconductor wafer planarizationLAM RES CORP·Filed 2008·Granted Sep 1, 2009·0 cites·15 claims
- 2954US2014322446A1Processes and systems for engineering a copper surface for selective metal depositionLAM RES CORP·Filed 2014·Application pending·0 cites
- 3052US9287110B2Method and apparatus for wafer electroless platingLAM RES CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 3151US2022108875A1Multi-location gas injection to improve uniformity in rapid alternating processesLAM RES CORP·Filed 2020·Application pending·0 cites
- 3251US2012269987A1Processes and Systems for Engineering a Barrier Surface for Copper DepositionDORDI YEZDI·Filed 2012·Application pending·0 cites
- 3350US7909934B2Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiencyLAM RES CORP·Filed 2005·Granted Mar 22, 2011·0 cites·11 claims
- 3450US2015214093A1Processes and systems for engineering a barrier surface for copper depositionLAM RES CORP·Filed 2015·Application pending·0 cites
- 3549US7884017B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2010·Granted Feb 8, 2011·0 cites·3 claims
- 3649US2023223292A1Flat bottom shadow ringLAM RES CORP·Filed 2021·Application pending·0 cites
- 3748US2011306203A1Interconnect structure and method of manufacturing a damascene structureDORDI YEZDI·Filed 2011·Application pending·0 cites
- 3847US7358186B2Method and apparatus for material deposition in semiconductor fabricationLAM RES CORP·Filed 2003·Granted Apr 15, 2008·1 cites·19 claims
- 3946US2010239767A1Apparatus for Applying a Plating Solution for Electroless DepositionDORDI YEZDI·Filed 2010·Application pending·0 cites
- 4044US2009304914A1Self assembled monolayer for improving adhesion between copper and barrier layerLAM RES CORP·Filed 2006·Application pending·0 cites
- 4144US2008152823A1Self-limiting plating methodLAM RES CORP·Filed 2006·Application pending·0 cites
- 4243US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
- 4343US2008057182A1Method for gap fill in controlled ambient systemBOYD JOHN·Filed 2006·Application pending·0 cites
- 4442US9997364B2High aspect ratio etchLAM RES CORP·Filed 2016·Granted Jun 12, 2018·0 cites·20 claims
- 4542US7368017B2Method and apparatus for semiconductor wafer planarizationLAM RES CORP·Filed 2003·Granted May 6, 2008·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when William Thie files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →